Teams at QuantWare

Lead end-to-end design, verification, and scaling of flex cable interconnects for the VIO quantum platform. Optimize RF signal integrity, mechanical reliability, and thermal performance. Manage vendor co-development, supplier schedules, and cross-functional execution. Mentor and grow the flex interconnect engineering team to enable verification through high-volume manufacturability.

Lead transfer of semiconductor/quantum device processes from R&D to kilofab, qualify incoming equipment via SAT, develop PQPs and SPC/FDC, run DOE and root-cause analysis, maintain MES recipe lifecycle, document SOPs, and train technicians to improve yield and repeatability.

Translate quantum device R&D into repeatable, high-yield fab processes. Lead equipment Site Acceptance Testing (IQ/OQ/PQ), transfer and qualify process modules (PVD, CVD, ALD, etch, evaporation, dicing, writing), deploy SPC/FDC and DOE for yield improvement, manage MES recipe lifecycle, document SOPs and qualification reports, and train technicians while collaborating across R&D, equipment, facilities, and production.