Teams at Lumai

Own dense, high-layer-count PCB layout from schematic handoff through fabrication release. Develop stackups, HDI structures, controlled-impedance routing, differential pairs, BGA breakouts, libraries, design rules, and manufacturing documentation. Translate SI/PI constraints into layout rules, conduct DFM/DFA/DFT reviews, manage revisions, and coordinate with fabricators and assembly houses. The role requires expert Cadence Allegro or equivalent Altium experience, production-proven high-speed board design, IPC knowledge, and advanced HDI and fine-pitch package expertise.

Own signal and power integrity for high-speed boards and packages. Perform pre- and post-layout channel analysis, SI/PI modeling, via and connector optimization, PDN design, and chip-package-board co-simulation. Correlate simulations with VNA, TDR, and oscilloscope measurements, evaluate materials and fabrication tolerances, and establish reusable methodologies, model libraries, and design guidelines for reliable high-speed hardware.

Designs and develops board-level analog and mixed-signal circuits for optical computing systems, including photodetector front ends, converters, laser and modulator drivers, power delivery, control loops, and precision references. Responsibilities span architecture, simulation, PCB layout guidance, component qualification, laboratory bring-up, characterization, production release, and collaboration with photonics and ASIC teams.