K2 Space Corporation Benefits Overview

Design and lead advanced ASIC package architectures, especially FC-BGA and MCM solutions, from early trade studies through production. Responsibilities include substrate stack-ups, ball maps, SI/PI, thermal management, signal breakout, material selection, qualification, and assembly optimization. The engineer partners with silicon, RF, and systems teams and manages OSAT and substrate-vendor relationships for high-performance, power-dense mixed-signal and digital SoCs.

Designs advanced ASIC packages, including FC-BGA and MCM architectures, from early trade studies through production. Responsibilities include substrate and ball-map definition, SI/PI and thermal design, high-speed signal breakout, material and assembly selection, vendor management, qualification, and collaboration with silicon, RF, and systems teams. The role focuses on high-pin-count, power-dense mixed-signal and digital SoC packages for high-reliability aerospace applications.

Lead end-to-end ASIC package architecture and execution for high-performance FC-BGA and MCM solutions. Own substrate stackups, ball maps, SI/PI, thermal design, material selection, vendor qualification, packaging standards, and production ramp. Partner with silicon, RF, and systems teams to optimize package interfaces and ensure reliable, first-pass success for high-pin-count, power-dense mixed-signal and digital ASICs.