.i3 Microsystems, Inc.

i3 Microsystems (i3M) provides advanced microelectronics packaging capabilities to government, industry, and academic partners via a robust heterogenous integration platform that delivers security, size, weight, and power benefits across aerospace, defense, and commercial applications. The i3M trusted pure-play semiconductor foundry in St. Petersburg, Florida has reliable manufacturing capability for fan-out wafer lever packaging (FOWLP), heterogeneous system in a package (HSIP), die extraction and recovery (DER), and flip chip and surface mount assembly (SMT). i3M has proven application to strategic, DX-rated DOD and other mission-critical programs; and a commitment to support the low-volume, high-mix needs of the DoD and DIB in a cost-effective manner. i3M serves as a solution for protecting our national security with secure domestic prototyping and manufacturing; accelerating innovation with state-of-the-art technologies; and strengthening our semiconductor supply chain and ecosystem through collaboration.

For more information, visit www.i3microsystems.com and www.hsip-pdk.info.