Teams at Ethernovia

Lead monthly, quarterly, and annual financial close activities; prepare GAAP-compliant reporting; manage revenue recognition, technical accounting, inventory, manufacturing cost accounting, and internal controls. Support audits, tax filings, IPO and SOX readiness, ERP process improvements, customer invoicing, and semiconductor supply-chain accounting. Partner with operations, sales, and supply chain teams while analyzing financial results and reporting to management.

Leads architecture, design, and production release of advanced IC packages for high-speed Ethernet switches and PHYs. Responsibilities include package feasibility, substrate stack-ups, bump and ball maps, complex FCBGA/FCCSP/SiP layouts, signal and power integrity, thermal co-design, manufacturing integration, and OSAT/vendor management. The role partners across silicon, systems, PCB, reliability, and manufacturing teams while guiding packaging technology strategy for automotive and high-performance networking applications.

Design and deliver complex digital SoCs for automotive communication systems, covering microarchitecture, RTL, verification, synthesis, lint, CDC, LEC, and static timing analysis. Collaborate with architects, software, hardware, and verification teams to define specifications, data flows, algorithms, interfaces, and resource management while meeting power, performance, and area targets. The role requires advanced ASIC design expertise, strong digital fundamentals, and experience with networking protocols or related semiconductor technologies.