Teams at Boyd

Lead process development and optimization for printing, die cutting, lamination, assembly and converting. Support NPI, validation (IQ/OQ/PQ), capability studies, troubleshoot production/quality issues, implement CAPA, drive Kaizen/Lean/Six Sigma initiatives, evaluate materials/equipment, coordinate tooling/ECN/ERP, ensure ISO compliance, prepare SOPs and participate in audits.

Design and implement new thin‑film processing (especially annealing), develop custom automation equipment, perform structural/kinematic analysis and CAE, optimize production (MTM, CT, DOE), maintain quality systems (PFMEA, SPC, ISO9001), commission/process-qualify equipment, lead cross-functional projects, and drive continuous improvement and failure analysis.

Support production activities for TTCS TCU/Adaptor/Sockets, ensuring products meet customer requirements. Evaluate, troubleshoot, modify, and test electronic parts, components, and integrated circuitry throughout manufacturing processes.