Teams at Array Labs

Own RF and microwave PCB layout from schematic placement through manufacturing release in Altium Designer. Define stack-ups, controlled-impedance routing, grounding, shielding, isolation, connector launches, and transitions. Collaborate with RF, electrical, antenna, mechanical, mixed-signal, and test engineers to meet performance requirements and ensure first-pass success. Drive DFM/DFT documentation, support fabrication and assembly partners, assist with lab bring-up and RF characterization, and validate layouts through EM and RF analysis workflows.

Lead high-speed PCB layout from component placement through manufacturing release in Altium. Define stack-ups, impedance targets, length-matching constraints, return paths, and reference-plane strategies for mixed-signal and high-speed digital electronics. Collaborate with electrical, firmware, mechanical, test, fabrication, and assembly teams to address SI/PI, DFM/DFT, manufacturing, lab bring-up, qualification, and environmental testing requirements.

Own RF and microwave PCB layout in Altium Designer from component placement through manufacturing release. Define stack-ups, controlled-impedance routing, grounding, shielding, isolation, connector launches, and transitions. Collaborate with RF, electrical, antenna, mechanical, mixed-signal, and test engineers to meet performance requirements and support DFM/DFT. Contribute to lab bring-up, RF characterization, environmental testing, and troubleshooting using measurement and EM analysis tools.