Teams at Array Labs

Design, lay out, prototype, manufacture, bring up, test, and qualify high-density digital, mixed-signal, power, RF, and compute circuit boards for radar satellites. Responsibilities include architecture, requirements, component selection, schematic capture, PCB layout, system trades, manufacturing management, hardware debugging, and validation through laboratory, environmental, and on-orbit testing. The engineer collaborates with RF, antenna, software, firmware, mechanical, and systems teams to optimize signal integrity, processing performance, thermal behavior, and spacecraft reliability.

Own RF and microwave PCB layout from schematic placement through manufacturing release in Altium Designer. Define stack-ups, controlled-impedance routing, grounding, shielding, isolation, connector launches, and transitions. Collaborate with RF, electrical, antenna, mechanical, mixed-signal, and test engineers to meet performance requirements and ensure first-pass success. Drive DFM/DFT documentation, support fabrication and assembly partners, assist with lab bring-up and RF characterization, and validate layouts through EM and RF analysis workflows.

Lead high-speed PCB layout from component placement through manufacturing release in Altium. Define stack-ups, impedance targets, length-matching constraints, return paths, and reference-plane strategies for mixed-signal and high-speed digital electronics. Collaborate with electrical, firmware, mechanical, test, fabrication, and assembly teams to address SI/PI, DFM/DFT, manufacturing, lab bring-up, qualification, and environmental testing requirements.