Teams at Analog Devices

Lead design and execution of tactile sensor characterization, qualification, and failure analysis. Build test fixtures, automate measurements with Python and LabVIEW, run benchtop electrical tests (oscilloscope, SMU, DAQ), perform FA (SEM/FIB/EDS), analyze data, and produce specifications and datasheets while collaborating with cross-functional robotics and fabrication teams.

Design, simulate, and characterize MEMS devices and packages (gyroscopes, accelerometers, IMUs). Develop package simulation flows, validate materials, perform wafer/part-level characterization, build SPICE/analytical models, co-design with ASIC and packaging teams, and transfer designs to production while collaborating with vendors and multidisciplinary teams.

Serve as a finance partner for ADC vertical: manage OpEx/CapEx and headcount planning, perform forecasting, month/quarter close support, variance analysis, SAP drill-downs, scenario modeling, spend governance, and deliver actionable reporting to leadership.