Teams at Allegro MicroSystems

Serves as the technical quality liaison for Japanese automotive and industrial customers, U.S. teams, and Southeast Asian manufacturing sites. Leads semiconductor quality investigations, root-cause analysis, corrective actions, 8D reporting, customer audits, and technical interpretation. Translates English and Japanese quality documentation, correlates electrical defects with physical failure analysis, and uses microscopy and semiconductor analysis techniques to resolve customer issues. Requires engineering education, semiconductor and failure-analysis experience, bilingual Japanese and English proficiency, and limited international travel.

Leads the design and development of complex hardware systems, including circuit architecture, PCB layouts, component libraries, schematics, BOMs, and fabrication packages. Performs validation and release activities, ensures compliance with industry standards, mentors junior engineers, conducts design reviews, and improves engineering processes and tools. Requires ownership of hardware products from concept through production and collaboration on ATE applications.

Develops and improves semiconductor package designs, manufacturing processes, equipment, materials, and specifications from pilot production through mass production. Coordinates new product releases with package design engineering, manages OSAT activities, performs failure analysis and process characterization, and optimizes process parameters using design of experiments. Leads technical personnel, supports qualifications and documentation, trains engineers and technicians, and applies APQP, FMEA, MSA, SPC, and PPAP methods to resolve complex manufacturing issues.