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The Role
Drives semiconductor manufacturing yield improvements by identifying yield limiters, performing statistical and failure analyses, debugging logic and memory failures, and correlating test, design, and process data. Develops yield roadmaps, measurement recipes, analytical tools, and modeling systems while supporting advanced process nodes, product introductions, and factory experiments. Collaborates with design, test, process, layout, and manufacturing teams to isolate root causes and improve product manufacturability.
Summary Generated by Built In
Job Details:Job Description: The Role and Impact
As a Yield Development Engineer, you will play a critical role in advancing Intel's manufacturing capabilities by driving technology yield improvements. You will work hands-on to identify yield limiters, conduct statistical analyses, and collaborate on process changes to optimize manufacturability. Your contributions will directly impact product quality, factory efficiency, and Intel's ability to deliver cutting-edge technologies to market.
Business group
The Intel Foundry team focuses on delivering high-performance solutions that empower customers across the globe. As part of this team, you will contribute to innovative process development and yield optimization efforts, supporting Intel's mission to lead in advanced semiconductor manufacturing. The group emphasizes collaboration and technical excellence to enable breakthrough innovations and industry-leading outcomes.
Key Responsibilities
- Identify and analyze yield limiters using statistical techniques and big data methodologies.
- Develop and implement process development roadmaps to support technology yield milestones.
- Consolidate, interpret, and visualize diverse data sources to extract actionable insights for yield enhancement.
- Perform fault isolation and failure analysis to identify root causes of failures.
- Collaborate across design, test, and process teams to debug yield limiters and ensure manufacturability.
- Develop measurement recipes and harden equipment capabilities for advanced logic nodes.
- Execute new product introductions, design-technology co-optimization, and factory experiments to drive yield improvements.
- Create tools, algorithms, and systems to perform high-volume data analysis and advance yield modeling.
- Drive cross-functional collaborations to resolve issues in yield, product design, and manufacturing processes.Qualifications:Bachelor's degree in electronic engineering, Computer Engineering or in a related field
Technical Skills
• 3+ years of experience in semiconductor failure analysis or test engineering
• Strong understanding of Array architecture and failure mechanisms or hands-on experience with SCAN ATPG methodology, including Scan chain diagnosis, ATPG pattern generation and debug, Fault models (stuck-at, transition, path delay, bridging)
• Proficiency in fault isolation techniques, including Electrical fault isolation (EFI), circuit, and layout analysis
• Familiarity with failure signature analysis and yield learning
Debug and Analysis
• Experience debugging logic and memory/array failures from silicon bring-up through production
• Ability to correlate ATE test results with design and process data
• Experience with tester platforms (e.g., Advantest, Teradyne)
• Understanding of DFT (Design for Testability) concepts and implementation
Preferred Qualifications
• Experience with embedded memory compilers and array redundancy analysis
• Familiarity with statistical data analysis tools (JMP, Python, R)
• Experience with nanometer process nodes (7nm, 5nm, 3nm, or below)
• Background in BIST (Built-In Self-Test) for memory and logic
• Exposure to machine learning-based fault classification or yield analysis
• Experience collaborating with design, process, and layout teams for root cause analysis
Soft Skills and Work Style
• Strong analytical and problem-solving skills
• Ability to work in a fast-paced, cross-functional environment
• Excellent communication skills to present findings to engineering and management teams
• Self-motivated with ability to manage multiple debug cases simultaneously
• Team player with experience working across design, process, and manufacturing organizations
Job Type:Experienced HireShift:Shift 1 (Malaysia)Primary Location: Malaysia, PenangAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in electronic engineering, computer engineering, or a related field
- 3+ years of experience in semiconductor failure analysis or test engineering
- Strong understanding of array architecture and failure mechanisms, or hands-on experience with SCAN ATPG methodology
- Experience with scan chain diagnosis, ATPG pattern generation and debugging, and fault models
- Proficiency in electrical fault isolation, circuit analysis, and layout analysis
- Experience with failure signature analysis and yield learning
- Experience debugging logic and memory or array failures from silicon bring-up through production
- Ability to correlate ATE test results with design and process data
- Experience with tester platforms such as Advantest or Teradyne
- Understanding of Design for Testability concepts and implementation
- Experience with embedded memory compilers and array redundancy analysis
- Familiarity with statistical data analysis tools such as JMP, Python, or R
- Experience with nanometer process nodes, including 7nm, 5nm, 3nm, or below
- Background in Built-In Self-Test for memory and logic
- Exposure to machine learning-based fault classification or yield analysis
- Experience collaborating with design, process, and layout teams for root cause analysis
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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What We Do
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