Ventiva is pioneering the next generation of thermal management, delivering air intelligence for electronic devices. Our breakthrough Ionic Cooling Engine (ICE®) technology provides efficient, silent cooling without fans—eliminating noise, vibration, and dust while enabling sleek, high-performance designs that traditional solutions simply can’t support. We are empowering OEMs and ODMs to break free from the conventional design constraints of the computing platforms used to tap into the AI infrastructure, from edge devices to enterprise hardware.
Ventiva solutions are unlocking new possibilities for electronics, enabling compute-intensive systems that are lightweight, quiet, and uncompromising in performance. If you thrive in a dynamic environment that values authenticity and bold thinking, and want to have an impact on the future of electronics, Ventiva is the place to do it.
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What We Offer
- Competitive salary and benefits package.
- Opportunities for professional growth and development.
- A collaborative and innovative work environment.
Ventiva, Inc. is an equal opportunity employer, and we encourage candidates of all backgrounds to apply.
What We Do
Ventiva is a leader in active cooling solutions for electronic devices, enabling thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company’s patented Ionic Cooling Engine (ICE) technology is a pioneering, all-electronic heat transfer technology that addresses the thermal problems exacerbated by modern high-performance semiconductor design.
Ventiva ICE technology generates movement of air without any moving parts, noise, or vibration, leveraging the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. The company’s ICE9 thermal management suite offers a “smart” cooling solution that continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the ICE9 suite’s real-time software can be combined with overall system performance monitoring to provide a robust device wide thermal solution.









