System Mechanical & Integration Engineer

Posted 2 Days Ago
Be an Early Applicant
Wilmington, MA, USA
In-Office
110K-152K Annually
Mid level
Artificial Intelligence • Hardware • Automation • Manufacturing
The Role
Design, integrate, and validate mechanical and thermal subsystems for high-voltage, high-power data center power solutions. Responsibilities include enclosure and busbar design, CFD thermal simulations, prototype builds, verification testing, manufacturability, and collaboration with electrical, reliability, and manufacturing teams to ensure robust, production-ready power distribution systems.
Summary Generated by Built In

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

          

System Mechanical & Integration Engineer

Wilmington, MA

Position Overview

Analog Devices’ High Voltage & Protection team is seeking a Systems Integration Engineer to support the development of next-generation data center power delivery solutions.

In this role, you will work alongside experienced power electronics, thermal, mechanical, systems, and reliability engineers to design, integrate, and validate high-density power supply systems for AI and cloud computing infrastructure. The focus will be on mechanical architecture development, thermal management, enclosure design, busbar integration, manufacturability, and system-level validation of high-power server and rack-level power solutions.

Key Responsibilities

In this role, your focus will be on hands-on mechanical and thermal development of power systems, with ownership commensurate with level and increasing responsibility over time.

  • Design and integrate mechanical subsystems for high voltage power conversion platforms, including HV DC/DC module, intelligent power system, and Power Distribution Box (PDB).
  • Own enclosure and structural design activities, including sheet metal design, die-cast components, machined parts, fastening strategies, tolerance stack-up analysis, manufacturability, and assembly considerations.
  • Develop thermal solutions for high-power electronic systems utilizing air cooling, liquid cooling, cold plates, heat sinks, vapor chambers, heat spreaders, and advanced thermal interface materials.
  • Perform thermal simulations and airflow analysis using industry-standard tools (Icepak, Fluent, 6SigmaET, FloTHERM, Star-CCM+, or equivalent) to optimize cooling performance and maintain component reliability.
  • Design and validate power interconnect solutions including busbars, copper current-carrying structures, high-current connectors, grounding systems, and electrical isolation features.
  • Collaborate closely with electrical and power electronics teams to optimize mechanical packaging of transformers, inductors, capacitors, semiconductors, and magnetic components.
  • Create and execute thermal, mechanical, vibration, shock, and environmental validation plans to ensure compliance with product and customer requirements.
  • Support prototype builds, design verification testing (DVT), and root-cause analysis of thermal, structural, or assembly-related issues.
  • Work with manufacturing partners, suppliers, and contract manufacturers to develop cost-effective, scalable, and production-ready mechanical solutions.
  • Document system architecture, design analyses, simulations, test results, and lessons learned to support product development and continuous improvement.

Required Qualifications

  • MS or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Electrical Engineering, or a related field.
  • 3+ experience with Strong foundation in multiple areas spanning:
    • Mechanical design and product development
    • Thermal management of electronic systems
    • System integration of power electronics platforms
    • Candidates with additional experience may be considered at the Senior Engineer level
  • Demonstrated experience (research, projects, internships, or industry) developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure.
  • Experience with CAD tools such as Creo, SolidWorks, NX, or CATIA.
  • Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications.
  • Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes.
  • Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements.
  • Strong analytical and problem-solving skills with a hands-on approach to design validation and troubleshooting.

Preferred Qualifications

  • Industry experience with data center power supplies, server platforms, rack-level power systems, renewable energy, or energy storage systems.
  • Experience designing high-power systems (>3 kW), power shelves, >400V power conversion platforms, or AI infrastructure hardware.
  • Proficiency with thermal simulation tools such as ANSYS Icepak, Fluent, FloTHERM, 6SigmaET, or Star-CCM+.
  • Experience with liquid-cooling technologies including cold plates, CDU integration, direct-to-chip cooling, and rack-level thermal management.
  • Knowledge of power electronics packaging including magnetic components, power semiconductors, busbar design, and EMC/EMI considerations.
  • Familiarity with mechanical reliability testing including vibration, shock, HALT/HASS, and environmental qualification.
  • Experience with DFM, DFA, FMEA, GD&T, tolerance stack-up, and production release processes.
  • Python or MATLAB experience for thermal data analysis, automation, and model correlation.
  • Strong communication skills and ability to work effectively in multidisciplinary engineering teams.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

          

Required Travel: Yes, 10% of the time

          

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $110,385 to $151,808.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Skills Required

  • MS or PhD in Mechanical, Thermal, Aerospace, Electrical Engineering, or related field.
  • 3+ years experience with mechanical design, thermal management, and system integration of power electronics platforms.
  • Demonstrated experience developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure.
  • Experience with CAD tools such as Creo, SolidWorks, NX, or CATIA.
  • Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications.
  • Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes.
  • Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements.
  • Strong analytical and problem-solving skills with a hands-on approach to design validation and troubleshooting.
  • Industry experience with data center power supplies, server platforms, rack-level power systems, renewable energy, or energy storage systems.
  • Experience designing high-power systems (>3 kW), power shelves, >400V power conversion platforms, or AI infrastructure hardware.
  • Proficiency with thermal simulation tools such as ANSYS Icepak, Fluent, FloTHERM, 6SigmaET, or Star-CCM+.
  • Experience with liquid-cooling technologies including cold plates, CDU integration, direct-to-chip cooling, and rack-level thermal management.
  • Knowledge of power electronics packaging including magnetic components, power semiconductors, busbar design, and EMC/EMI considerations.
  • Familiarity with mechanical reliability testing including vibration, shock, HALT/HASS, and environmental qualification.
  • Experience with DFM, DFA, FMEA, GD&T, tolerance stack-up, and production release processes.
  • Python or MATLAB experience for thermal data analysis, automation, and model correlation.
  • Strong communication skills and ability to work effectively in multidisciplinary engineering teams.

Analog Devices Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Analog Devices and has not been reviewed or approved by Analog Devices.

  • Retirement Support The 401(k) program is described as a standout feature, with company contribution up to 8% of base salary and immediate vesting. This structure strengthens long-term value even when cash compensation perceptions vary.
  • Healthcare Strength Health coverage is positioned as comprehensive, including medical, dental, and vision options along with disability and life insurance. Day-one eligibility and multiple plan choices add to perceived robustness.
  • Leave & Time Off Breadth Paid time off appears broad, with vacation ranging from roughly 17–25 days and increasing up to five weeks with tenure, alongside sick time and paid holidays. Parental leave and related time-off provisions further expand coverage.

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The Company
HQ: Wilmington, MA
20,292 Employees
Year Founded: 1965

What We Do

Analog Devices, Inc. (NASDAQ: ADI) operates at the center of the modern digital economy, converting real-world phenomena into actionable insight with its comprehensive suite of analog and mixed signal, power management, radio frequency (RF), and digital and sensor technologies. ADI serves 125,000 customers worldwide with more than 75,000 products in the industrial, communications, automotive, and consumer markets. ADI is headquartered in Wilmington, MA.

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