• Collaborate with foundry partners to define and improve the CIS silicon, color and package process for each CIS technology.
• Provide support to production and design teams to improve yield and overall sensor performance, establishing process flow applicable to mass production.
• Design and manage silicon split lots with respect to project goals and schedules to achieve performance targets, meet production requirements, and research and development of future technologies.
• Analyze and interpret large volumes of bench and wafer level data; feedback to pixel and wafer split design to optimize design and improve performance.
• Work in close collaboration with internal pixel design and characterization engineers, and external foundry partners; primary liaison between internal and external teams to drive effective technical communication and discussion.
• Work with characterization engineers to analyze data and test results, provide feedback on evaluation methods and settings to improve testing efficiency and accuracy; coordinate evaluation schedule and equipment to enable testing.
• Continuously track technology improvement and state of art developed by foundry; select and implement appropriate fabrication processes to meet CIS performance and yield targets; closely monitor lot processing and swiftly address/feedback any issues to foundry to mitigate product loss and schedule delay.
• Photolithography and microfabrication techniques (electron beam, thermal deposition, sputtering, reactive ion etching) in a clean room environment.
• Silicon and semiconductor device testing, including electron microscopy (SEM, TEM), atomic force microscopy (AFM), spectroscopy techniques (photo- and fluoro- luminescence, Fourier transform IR spectroscopy, UV-vis), and optical and electrical device characterization.
• Defining project roadmaps, performance targets, and schedules.
Skills Required
- Master's degree or foreign equivalent in Electrical Engineering, Computer Engineering, or a related field
- Two years of experience developing and fabricating semiconductor devices
- Experience developing and fabricating semiconductor devices, including designing and managing experimental splits to achieve performance targets
- Experience with photolithography and microfabrication techniques, including electron beam, thermal deposition, sputtering, and reactive ion etching, in a cleanroom environment
- Experience with silicon and semiconductor device testing, including SEM, TEM, AFM, spectroscopy, and optical and electrical device characterization
- Experience defining project roadmaps, performance targets, and schedules
What We Do
Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical
