Sr Principal Process Development Engineer

Posted 3 Days Ago
Be an Early Applicant
Livermore, CA, USA
In-Office
136K-179K Annually
Senior level
Hardware • Semiconductor • Quantum Computing • Manufacturing
The Role
Own and optimize SMT processes for advanced probe card PCB manufacturing. Responsibilities include developing recipes, managing stencil printers, pick-and-place machines, reflow ovens and inspection systems, improving yield and process capability, troubleshooting equipment and defects, maintaining documentation and preventive maintenance, supporting production and new product introductions, and leading Lean Six Sigma, DfX, equipment improvement, and cross-functional manufacturing initiatives.
Summary Generated by Built In

Forming Our Future together

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

Shift:

The regular hours for this position are day shift.

Job Description:

The Sr Principal Process Development Engineer is responsible for owning, optimizing, and supporting Surface Mount Technology processes used in probe card manufacturing. This role ensures high‑quality PCB assembly, stable process capability, and predictable output across pick‑and‑place, reflow, inspection, and associated upstream/downstream steps. The engineer provides technical leadership for SMT line performance, defect reduction, equipment improvements, and cross‑functional integration with plating, lithography, mechanical assembly, and electrical test teams.

Key Responsibilities:

SMT Process Engineering

  • Develop, qualify, and maintain SMT processes, solder paste selection, solder paste injection and inspection, reflow profiling, and placement parameters.

  • Own recipe creation and optimization for high‑density advanced probe card PCBs.

  • Drive process capability improvements (Cp/Cpk) and ensure stable production performance.

Equipment Ownership

  • Provide daily engineering support for SMT equipment such as:

    • Stencil printer

    • Pick‑and‑place machine

    • Reflow oven

    • SPI (Solder Paste Inspection)

  • Lead troubleshooting and root cause analysis for equipment failures, misplacements, reflow defects, or inspection inaccuracies.

  • Define and maintain PM schedules, calibration, and spare parts strategies.

Quality & Yield Improvement

  • Monitor and analyze yield, defect Paretos, and SPC trends to identify systemic issues.

  • Lead DfX (Design for Assembly, Design for Manufacturability) discussions with design engineering.

  • Implement corrective actions and sustainable process controls for solder bridging, opens, voiding, tombstoning, and wetting failures.

Manufacturing Support

  • Support production technicians with process deviations, equipment issues, and new product introductions.

  • Develop documentation including WI/SOPs, process parameters, machine setup sheets, and inspection criteria.

  • Drive cycle time reduction, throughput improvements, and operator training.

Cross‑Functional Collaboration

  • Work closely with:

    • Plating & Metallization Engineers

    • Photolithography Engineers

    • Mechanical/Assembly Engineering

    • Electrical Test Engineering (FPT, PRVX4)

    • Supply Chain & Quality

  • Provide engineering support during prototype builds and customer‑specific configurations.

Continuous Improvement

  • Lead Lean/6σ initiatives to reduce waste, improve flow, and enhance process robustness.

  • Evaluate and introduce new materials (solder paste, adhesives, fluxes) and improved stencil/hardware designs.

  • Participate in equipment justification and capital project planning.

Preferred Qualifications & Experiences:

  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or related field.

  • 3–7 years of SMT or PCB assembly experience (semiconductor, PCBA, or electronics assembly preferred).

  • Strong understanding of solder paste behavior, reflow principles, component placement strategies, and defect mechanisms.

  • Hands‑on experience with SMT equipment and inspection systems (SPI, AOI).

  • Proficiency with SPC, FMEA, DOE, and root cause problem solving.

  • Experience in probe card, semiconductor test hardware, or high‑precision PCB manufacturing.

  • Familiarity with high‑density BGAs, fine‑pitch components, and micro‑assembly.

  • Knowledge of CAM/EDA data for stencil/paste aperture optimization.

  • Lean/6σ Green Belt or Black Belt certification.

  • Experience with MES systems and factory automation.

Success Traits:

  • Strong ownership mindset and ability to lead daily factory support.

  • Excellent troubleshooting skills and a structured approach to problem solving.

  • Ability to work cross‑functionally in a fast‑paced, high‑mix environment.

  • Clear communication and documentation discipline.

  • Passion for continuous improvement and operational excellence.

Skills:

Assembly Manufacturing, Assembly Operations, Integration Development, Perform Testing, Process Performance, Product Assembly, Test Analysis, Test Evaluation

Education & Experience:

Minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree; or a PhD with 3 years experience; or equivalent experience | Required

Pay Range:

$136,200.00 - $178,815.00

Pay Range Explained:

This role in Livermore, California pays between $136,200.00 and $178,815.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You’ll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.

Equal Employment Opportunity Statement

FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.


For roles that are designated as remote-eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated, please check back with us if the state you live in is on the exclusion list. A role is remote-eligible only when it is listed as "Remote" in the job location.


Skills Required

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or a related field
  • Minimum of 8 years of related experience with a bachelor's degree, or 6 years with a master's degree, or 3 years with a PhD, or equivalent experience
  • 3-7 years of SMT or PCB assembly experience
  • Strong understanding of solder paste behavior, reflow principles, component placement strategies, and defect mechanisms
  • Hands-on experience with SMT equipment and inspection systems, including SPI and AOI
  • Proficiency with SPC, FMEA, DOE, and root cause problem solving
  • Experience in probe card, semiconductor test hardware, or high-precision PCB manufacturing
  • Familiarity with high-density BGAs, fine-pitch components, and micro-assembly
  • Knowledge of CAM/EDA data for stencil and paste aperture optimization
  • Lean Six Sigma Green Belt or Black Belt certification
  • Experience with MES systems and factory automation

FormFactor, Inc. Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about FormFactor, Inc. and has not been reviewed or approved by FormFactor, Inc..

  • Healthcare Strength — Health coverage offers multiple plan options (e.g., several Cigna choices and regional Kaiser HMO) with good pricing noted for some low‑deductible choices. This area stands out as a relative strength of the package.
  • Equity Value & Accessibility — An employee stock purchase plan with at least a 15% discount via payroll deductions is broadly available alongside standard bonus programs. This accessibility provides a straightforward path to ownership even when base pay sentiment is mixed.
  • Leave & Time Off Breadth — Paid time off, holidays, and formal leaves (jury duty, bereavement, military) are included, with “generous PTO” highlighted in some descriptions. This breadth of time‑away options aligns with expectations for a mid‑sized tech manufacturer.

FormFactor, Inc. Insights

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The Company
HQ: Livermore, CA
1,903 Employees
Year Founded: 1993

What We Do

FormFactor, Inc. is a leading provider of essential test and measurement technologies for the semiconductor industry, offering products like probe cards, analytical probes, and cryogenic systems to support the full integrated circuit (IC) life cycle.

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