Sr Principal PCB Design Engineer

Forming Our Future together

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

Shift:

The regular hours for this position are day shift.

Job Description:

FormFactor is seeking an experienced Sr Principal PCB Design Engineer to lead the design and development of advanced high-performance probe card printed circuit boards supporting next-generation semiconductor test solutions. This role serves as a technical leader for complex PCB architectures, driving design quality, schedule execution, process improvements, and collaboration across Electrical Design Engineering (EDE), Signal Integrity (SI), Mechanical Engineering (ME), Applications Engineering, Manufacturing, and external suppliers.

The Sr Principal PCB Design Engineer will be responsible for the most challenging and strategic PCB designs, including advanced HBM, high-speed digital, RF, and mixed-signal applications. The position requires deep technical expertise, strong leadership skills, and the ability to mentor designers while influencing design methodologies and engineering best practices across a global organization.

Key Responsibilities:

• Lead architecture, layout, and implementation of highly complex multilayer PCB designs for semiconductor test and probe card applications.

• Develop innovative design solutions for high-density, high-speed, and high-current products, including HBM and advanced packaging technologies.

• Drive design execution from concept through release while ensuring schedule, quality, and manufacturability objectives are achieved.

• Partner closely with SI, EDE, Applications, Mechanical Engineering, Manufacturing, and Supply Chain teams to optimize product performance and reliability.

• Define PCB stackups, routing strategies, impedance requirements, power distribution networks, and manufacturability considerations.

• Perform and review constraint management, signal integrity implementation, power integrity requirements, and design rule compliance.

• Provide technical leadership and mentoring for PCB designers across multiple regions.

• Establish and improve PCB design methodologies, standards, checklists, automation workflows, and best practices.

• Lead technical reviews and support root cause analysis of design, manufacturing, and field-related issues.

• Evaluate and deploy new design tools, technologies, and automation opportunities to improve engineering efficiency.

• Support customer escalations and critical business priorities requiring advanced technical expertise.

Preferred Qualifications & Experiences:

• Bachelor's degree in Electrical Engineering, Electronics Engineering, or related technical field.

• PCB design experience in high-speed digital, RF, mixed-signal, or semiconductor-related products.

• Expert knowledge of PCB layout tools such as Cadence Allegro, Siemens Xpedition, or equivalent.

• Expert Knowledge in PCB manufacturing and assembly/test a strong plus

• Strong understanding of high-speed signal routing, powder distribution network design, controlled impedance design, design for manufacturing (DFM), design for assembly (DFA), and PCB fabrication and assembly technologies.

• Experience designing complex multilayer boards with high-density interconnects (HDI), BGAs, microvias, and advanced packaging technologies.

• Ability to independently drive technically challenging projects with minimal supervision.

• Strong problem-solving, communication, and leadership skills.

• Experience supporting semiconductor test hardware, probe cards, or advanced packaging applications.

• Knowledge of signal integrity and power integrity concepts.

• Experience working in global engineering organizations.

• Experience mentoring PCB designers and leading technical initiatives.

• Familiarity with automation, scripting, and PCB design process optimization.

Leadership Competencies:

• Recognized technical authority within the PCB organization.

• Drives engineering excellence and continuous improvement initiatives.

• Influences design strategy and technical direction across multiple programs.

• Mentors' engineers and designers to accelerate organizational capability and growth.

• Demonstrates ownership, accountability, and customer-focused execution.

Skills:

Allegro PCB Designer, Co-Design, Communication, High Speed PCB Design, Multilayer PCB Design, PCB Fabrication, PCB Layout, PCB Layout Design, Printed Circuit Board (PCB) Soldering, Printed Circuit Board Assembly (PCBA), Printed Circuit Board Design Software, Printed Circuit Board Manufacturing, Printed Circuit Boards (PCB), Team Communication, Teamwork, Technical Communication

Education & Experience:

Minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree; or a PhD with 3 years experience; or equivalent experience | Required

Pay Range:

$136,200.00 - $178,815.00

Pay Range Explained:

This role in Livermore, California pays between $136,200.00 and $178,815.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You’ll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.

Equal Employment Opportunity Statement

FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.

For roles that are designated as remote-eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated, please check back with us if the state you live in is on the exclusion list. A role is remote-eligible only when it is listed as "Remote" in the job location.