Sr. IC Package Design Engineer (Silicon Engineering)

Posted Yesterday
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Austin, TX, USA
In-Office
Senior level
Aerospace • Other
The Role
Designs and leads advanced IC packaging for custom ASICs and RFICs used in Starlink systems. Responsibilities include package selection, BGA and SiP configuration, substrate and layout design, optimization, verification, tapeout, and signal, power, and RF integrity simulation. The engineer coordinates with cross-functional silicon, firmware, systems, architecture, validation, and manufacturing teams while driving package-design methodologies and productivity improvements.
Summary Generated by Built In

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

SR. IC PACKAGE DESIGN ENGINEER (SILICON ENGINEERING) 

At SpaceX we’re leveraging our experience in building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation and is providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact and are looking for best-in-class engineers to help maximize Starlink’s utility for communities and businesses around the globe. 

We are seeking a motivated, proactive, and intellectually curious engineer who will work alongside world-class cross-disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation). In this role, you will be developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures around the globe. These chips are enabling connectivity in places it has previously not been available, affordable or reliable. As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems. 

RESPONSIBILITIES:

  • Own and drive advanced package selection, new product BGA configuration and package structure
  • Responsible for package/SIP layout, optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
  • Simulate and optimize signal/power integrity and RF performance of the package design
  • Drive methodology, innovations, and productivity improvements in package design

BASIC QUALIFICATIONS:

  • Bachelor's degree in electrical engineering, computer engineering, or physics
  • 5+ years of experience with IC package design

PREFERRED SKILLS AND EXPERIENCE:

  • Experience with Co-packaged Optics (CPO)
  • Thorough understanding of signal and power integrity fundamentals
  • Substrate design experience for RF, digital, high-speed and mixed signal die
  • Experience with Cadence APD+/SIP or similar design tools
  • Experience in package design electrical review, SI/PI analysis
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
  • Experience in package design for manufacturing reviews
  • Familiar with BGA package substrate technologies
  • Strong problem solving skills with strong engineering fundamentals

ADDITIONAL REQUIREMENTS:

  • Ability to work extended hours or weekends as needed to meet mission critical deadlines

ITAR REQUIREMENTS:

  • To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.  

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to [email protected]. 

Skills Required

  • Bachelor's degree in electrical engineering, computer engineering, or physics
  • 5+ years of experience with IC package design
  • U.S. citizenship or national, lawful permanent residence, refugee or asylee status, or eligibility to obtain required U.S. Department of State authorizations under ITAR
  • Ability to work extended hours or weekends as needed for mission-critical deadlines
  • Experience with Co-packaged Optics (CPO)
  • Thorough understanding of signal and power integrity fundamentals
  • Substrate design experience for RF, digital, high-speed, and mixed-signal die
  • Experience with Cadence APD+/SIP or similar design tools
  • Experience in package design electrical review and SI/PI analysis
  • Fluency with SI/PI and electromagnetic simulation tools such as SIWave, HFSS, and ADS
  • Experience in package design for manufacturing reviews
  • Familiarity with BGA package substrate technologies
  • Strong problem-solving skills and engineering fundamentals

SpaceX Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about SpaceX and has not been reviewed or approved by SpaceX.

  • Equity Value & Accessibility — Equity grants are a core part of total compensation, with periodic company-run tender offers that create liquidity before any public listing. These mechanisms can make the equity component feel materially valuable in practice.
  • Healthcare Strength — The package includes comprehensive medical, dental, and vision coverage, with on-site clinics and health resources at major sites. This breadth of coverage is presented as a strong element of the offering.
  • Wellbeing & Lifestyle Benefits — Major locations feature on-site amenities such as fitness facilities, food/coffee, clinics, and other conveniences. These lifestyle perks enhance day-to-day value alongside cash and equity.

SpaceX Insights

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The Company
HQ: Hawthorne, CA
8,879 Employees
Year Founded: 2002

What We Do

SpaceX designs, manufactures and launches the world’s most advanced rockets and spacecraft. The company was founded in 2002 by Elon Musk to revolutionize space transportation, with the ultimate goal of making life multiplanetary. SpaceX has gained worldwide attention for a series of historic milestones. It is the only private company ever to return a spacecraft from low-Earth orbit, which it first accomplished in December 2010. The company made history again in May 2012 when its Dragon spacecraft attached to the International Space Station, exchanged cargo payloads, and returned safely to Earth — a technically challenging feat previously accomplished only by governments. Since then Dragon has delivered cargo to and from the space station multiple times, providing regular cargo resupply missions for NASA.

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