At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Software Architect either based in Hyderabad OR Bangalore.
Responsibilities:
- Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)
- Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite
- Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)
- Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)
- Own customer SDK and tools (C/Python, CLI, log analysis), release management
- Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)
- Travel: Up to 25% (customer engagement, manufacturing, standards)
Skills:
- Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests
- Good knowledge of I2C/MCTP, SFF-8024, vendor extensions
- Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)
- Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)
- Self-motivated, with strong sense of ownership and responsibility
- Good communication and reporting skills
Experience:
- Principal / Senior Staff (8-10 years post-degree)
- 8-10 years high-speed interconnect software (module SW, management, test, SDK)
- CMIS 4.x/5.x implementation and OSFP MSA experience
- Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)
- Test software architecture with ATE/yields
- Manufacturing and field support experience
Education:
- BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Skills Required
- 8-10 years high-speed interconnect software experience
- CMIS 4.x/5.x implementation experience
- Hyperscaler interop with NIC/switch ASICs
- Experience in manufacturing and field support
- BS in Electrical Engineering, Computer Engineering, or Computer Science
What We Do
Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry. Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective. Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF. These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems. Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.
