We are looking for a Software Architect to help build scalable EDA flows and AI-driven automation for advanced 3DIC applications. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3DIC, interposer, and RDL system flows.
Core Responsibilities- Build scalable EDA flows using C++, Tcl, Python, and Java.
- Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
- Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
- Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
- Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.
- Strong background in EDA data structures and algorithms.
- Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
- Experience with DB-driven design flows, such as Innovus or similar implementation platforms.
- Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
- Knowledge of constraint-driven design, including timing, signal integrity, DRC, and related implementation constraints.
- Experience handling large-scale design problems, including high bump-count designs and multi-region routing challenges.
- Experience with 3DIC, 3.5D, or 2.5D designs.
- Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
- Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation.
- Knowledge of multi-tool integration and end-to-end flow automation.
- Ability to translate complex EDA workflows into scalable, user-friendly automation solutions.
- Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
- Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions.
The annual salary range for California is $178,500 to $331,500. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.
We’re doing work that matters. Help us solve what others can’t.Skills Required
- Build scalable EDA flows using C++, Tcl, Python, and Java
- Strong background in EDA data structures and algorithms
- Hands-on experience with Tcl, Python, and C++ automation in EDA tools
- Experience with DB-driven design flows such as Innovus or similar implementation platforms
- Understanding of 3DIC, interposer, packaging routing, and RDL design flows
- Knowledge of constraint-driven design including timing, signal integrity, and DRC
- Experience handling large-scale design problems, including high bump-count designs and multi-region routing
- Bachelor's or Master's degree in Computer Science, Electrical Engineering, Computer Engineering, or related field
- Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions
- Experience with 3DIC, 3.5D, or 2.5D designs
- Familiarity with EMIR and thermal considerations in advanced packaging environments
- Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation
- Knowledge of multi-tool integration and end-to-end flow automation
- Ability to translate complex EDA workflows into scalable, user-friendly automation solutions
Cadence Design Systems Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cadence Design Systems and has not been reviewed or approved by Cadence Design Systems.
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Equity Value & Accessibility — A discounted ESPP with a lookback feature and equity included in total compensation make ownership broadly accessible and potentially meaningful. Structured compensation at an industry leader adds predictability to equity participation.
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Healthcare Strength — Medical, dental, and vision coverage are described as solid, with mental‑health/EAP and fertility support enhancing the offering. The breadth across core care and family‑building needs strengthens the healthcare package.
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Leave & Time Off Breadth — Global Recharge Days, volunteer time off, and companywide breaks indicate a comprehensive time‑off framework. In addition, many salaried roles are described as having flexible or generous PTO policies.
Cadence Design Systems Insights
What We Do
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and IP are used by customers to deliver products to market faster. The company's Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.
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