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Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.
As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, bridge from lab to fab to develop technologies, enable new markets, and scale-up for volume products.
About the Position
Kilby Labs is seeking a highly motivated Silicon Photonics Design Engineer to design silicon photonics solutions for advanced data communications applications and establish methodologies, tools, and automation flows for silicon photonics design. In this role, you will be responsible for the design and layout of transmit and receive Photonic Integrated Circuits (PICs). The role includes working closely with system architecture, packaging, validation, and test engineering team members to ensure successful prototyping, product development, and launch. The role requires a creative problem-solver with a strong background in electromagnetic design fundamentals who can develop unique, breakthrough technologies that leap-frog the state-of-the-art and contribute across various aspects of a project.
Responsibilities may include, but are not limited to:
- Design and develop passive and active PIC components such as advanced passive waveguide circuit elements, and high-speed active components such as modulators and Ge-based waveguide detectors for high performance (>200Gbps/ln) datacom applications, while driving continuous improvements in power efficiency and area.
- Work closely with systems and design team members to understand system specifications and translate them into circuit level requirements.
- Collaborate with layout team to translate the designs into DRC clean layouts that meet specifications while guaranteeing high yields.
- Engage with systems and packaging teams to architect, design and simulate advanced packaging solutions for high bandwidth and high-density interfaces for datacom applications.
- Drive test methodology and collaborate with characterization and product engineering teams to enable product validation and production ramp.
- Collaborate with technology development team to define process requirements and specifications for new silicon photonics platforms.
- Participate in R&D to develop next generation photonics technologies, drive IP development.
- Present work and findings to internal and external stakeholders through technical documents and design reviews.
Minimum Requirements:
- Master’s or PhD degree in Electrical Engineering, Physics, Applied Physics, Photonics, Optical Communications or related field.
- Experience with high-speed modulator and detector design and/or passive photonic component design and photonic integrated circuit design.
- Strong understanding of PIC circuit design and layout, experience contributing to or leading PIC tapeouts.
- Experience with electromagnetic and photonic simulators such as HFSS, Lumerical, Tidy3D, PhotonDesign, Optiwave, COMSOL.
- Proficiency with IC design tools (Cadence Virtuoso, Maestro, LayoutXL) as well as photonic design enablement tools such as Synopsys, Luceda, GDSFactory.
- Ability to work both independently and as part of a team, with strong verbal and written communication skills.
- Ideal candidate must excel at promoting new ideas, building collaborative relationships and working across organizations to work on common goals.
Preferred Qualifications:
- Experience with Electronic-Photonic Design Automation (EPDA) flows, co-simulating photonic circuits with CMOS driver/TIA circuits in a unified environment.
- Experience using scripted layout frameworks to automate complex photonic routing.
- Experience with package and board design tools such as Synopsys Altium and Cadence Allegro.
- Experience with hands-on silicon photonics volume test and wafer-level test automation
- Experience with technical approaches for next-gen (beyond 200 Gb/s/lane) silicon photonics including non-silicon materials
- Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics.
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
Skills Required
- Master's or PhD degree in Electrical Engineering, Physics, Applied Physics, Photonics, Optical Communications, or a related field
- Experience with high-speed modulator and detector design, passive photonic component design, and/or photonic integrated circuit design
- Strong understanding of PIC circuit design and layout
- Experience contributing to or leading PIC tapeouts
- Experience with electromagnetic and photonic simulators such as HFSS, Lumerical, Tidy3D, PhotonDesign, Optiwave, or COMSOL
- Proficiency with Cadence Virtuoso, Maestro, and LayoutXL
- Proficiency with photonic design enablement tools such as Synopsys, Luceda, or GDSFactory
- Ability to work independently and collaboratively with strong verbal and written communication skills
- Experience with electronic-photonic design automation flows and co-simulation with CMOS driver and TIA circuits
- Experience using scripted layout frameworks to automate complex photonic routing
- Experience with package and board design tools such as Synopsys, Altium, or Cadence Allegro
- Experience with silicon photonics volume testing and wafer-level test automation
- Experience with next-generation silicon photonics beyond 200 Gb/s per lane, including non-silicon materials
- Understanding of optical networking applications, including pluggable modules and co-packaged optics
Texas Instruments Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Texas Instruments and has not been reviewed or approved by Texas Instruments.
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Strong & Reliable Incentives — Profit sharing and annual bonuses are portrayed as a meaningful, formula-linked upside that can materially lift total earnings in strong years. An employee stock purchase plan with a discount further reinforces recurring, wealth-building incentives.
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Retirement Support — A 401(k) match is described as a stable core benefit, with some references to additional legacy employer contributions and even pension-like elements for certain cohorts. This framing positions long-term savings support as a notable part of the overall rewards package.
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Healthcare Strength — Medical coverage is depicted as broadly comprehensive, with preventive care and access to HSA/FSA features cited as value-adds. Company-seeded HSA contributions are repeatedly characterized as an important offset to the plan design for those enrolled.
Texas Instruments Insights
What We Do
Texas Instruments develops semiconductor and computer technology for cellular handsets, digital signal processors and analog semiconductors. Texas Instruments has been making progress possible for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Our more than 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It’s what we do and have been doing for decades. Learn more https://news.ti.com/index.cfm
