About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.
We are seeking a highly organized and detail‑oriented Process Integration Engineer to support Manufacturing Operations by optimizing and transferring existing 0.18um Mixed Signal and BCD manufacturing processes, driving cross‑functional teams to resolve technical issues, and interfacing with internal and external customers. This role includes ownership of analog/mixed‑signal device processing, parametric testing, and defect analysis for legacy and new technology products.
Provide technical ownership of BiCMOS and BJT‑focused manufacturing process flows, including transferring processes from foundry to internal manufacturing site
Execute and support tape‑out activities for transferring legacy and new semiconductor products into the Beaverton fab.
Review and interpret source GDS, mask lists, MT‑form data, and validate against internal process flows and PDK structures.
Ensure correct layer generation, scribe selection, die‑size matching, test‑line placement, and alignment with established flow requirements.
Identify when new modules, process options, or flow changes are needed and work with cross‑functional integration teams to develop and enable them.
Lead engineering teams to investigate and resolve yield, defect, and parametric performance issues.
Optimize manufacturing processes through design of experiments (DOE) and systematic data analysis.
Evaluate and disposition wafers and lots based on electrical test results and inline parametric data.
Drive Corrective and Preventative Actions (8D processes) to address root cause and prevent recurrence.
Serve as a technical interface between Process Integration, Module Engineering, Manufacturing, Quality, and external foundries.
Communicate clearly and effectively in high‑visibility situations with executive management, key customers, and auditors.
5+ years experience as a semiconductor Process Engineer or Process Integration Engineer.
Master’s degree or above in Electrical Engineering.
Strong technical foundation in wafer fabrication processes, including:
Photolithography
Chemical Mechanical Polishing (CMP)
Diffusion
Chemical Vapor Deposition (CVD)
Wet and dry etch
Rapid Thermal Annealing (RTA)
Ion implantation
Epitaxial growth
Metallization
Demonstrated knowledge of semiconductor device physics, particularly CMOS and BJT technologies.
Strong communication skills with the ability to remain composed, clear, and effective in challenging or diverse situations.
Working knowledge of statistical process control (SPC) and applied statistics.
Strong attention to detail with proven root‑cause analysis capability.
Basic familiarity with failure analysis methodologies.
Experience with foundry tape‑out flows (TSMC or similar).
Experience with foundry NPI, including troubleshooting tape‑out and process‑transfer issues.
Background in IC wafer fabrication engineering, semiconductor materials, manufacturing systems, and wafer electrical test.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: ExperiencedRequired Travel: Yes, 10% of the time
Shift Type: 1st Shift/DaysThe expected wage range for a new hire into this position is $95,600 to $131,450.
Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
Skills Required
- 5+ years experience as a semiconductor Process Engineer or Process Integration Engineer
- Master's degree or above in Electrical Engineering
- Strong technical foundation in wafer fabrication processes, including Photolithography, CMP, Diffusion, CVD, Wet and dry etch, RTA, Ion implantation, Epitaxial growth, and Metallization
- Demonstrated knowledge of semiconductor device physics, particularly CMOS and BJT technologies
- Strong communication skills in challenging situations
Analog Devices Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Analog Devices and has not been reviewed or approved by Analog Devices.
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Retirement Support — The 401(k) program is described as a standout feature, with company contribution up to 8% of base salary and immediate vesting. This structure strengthens long-term value even when cash compensation perceptions vary.
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Healthcare Strength — Health coverage is positioned as comprehensive, including medical, dental, and vision options along with disability and life insurance. Day-one eligibility and multiple plan choices add to perceived robustness.
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Leave & Time Off Breadth — Paid time off appears broad, with vacation ranging from roughly 17–25 days and increasing up to five weeks with tenure, alongside sick time and paid holidays. Parental leave and related time-off provisions further expand coverage.
Analog Devices Insights
What We Do
Analog Devices, Inc. (NASDAQ: ADI) operates at the center of the modern digital economy, converting real-world phenomena into actionable insight with its comprehensive suite of analog and mixed signal, power management, radio frequency (RF), and digital and sensor technologies. ADI serves 125,000 customers worldwide with more than 75,000 products in the industrial, communications, automotive, and consumer markets. ADI is headquartered in Wilmington, MA.
