You will design, implement, and deliver photonics integrated circuits (PICs) with optical gain and lasers in the OpenLight proprietary heterogenous silicon-IIIV photonic platform, for applications including data center communications, LiDAR, optical computing, and sensing. This work is done by working cross-functionally with, and ensuring alignment between, customers, business development, component design, layout, test, and reliability engineers, to deliver PICs that meet expected performance and applications. In other words: You will play a critical role in bringing new products to market.
What You Will DoDrive the definition, design, simulation, layout, and test of silicon photonic circuits working with customers and across functional teams within OpenLight.
Work with customers to map their product requirements onto OpenLight proprietary heterogenous silicon-IIIV photonic platform. Perform initial feasibility studies, define program timelines and deliverables.
Use industry standards and trends to derive requirements for OpenLight reference PIC designs.
Use commercial and custom-built tools to design and model custom PICs. Present results to customers and internal stakeholders.
Coordinate packaging, chip interface requirements, and fabrication requirements with packaging, layout, and process teams.
Define test requirements, review test plans, and analyze test data.
Identify, specify, and prioritize new components to develop for the PDK roadmap. Work with component designers to ensure that new components can meet specifications.
Ph.D. in Electrical Engineering, Applied Material Science, Applied Physics or related discipline
10+ years of relevant work experience (professional and PhD experience combined)
Proven record of working across organization boundaries and driving complex programs to successful completion through collaboration.
In-depth understanding of photonic integrated circuits and their components: lasers, modulators, amplifiers, detectors, passives, and optical coupling.
In-depth knowledge of opto-electronic device requirements for datacom and LiDAR applications.
Hands-on experience with high-speed optical testing is desirable.
Hands-on experience with packaging is desirable.
Strong problem-solving, communication, organizational, interpersonal and presentation skills.
OpenLight is growing as customer adoption and industry momentum continue to accelerate. The rapid growth of AI and cloud infrastructure is driving unprecedented demand for faster, more energy-efficient optical connectivity. We are addressing this challenge through a platform approach that simplifies the development of photonic integrated circuits (PICs) and accelerates industry adoption.
As part of our team, you will contribute to technologies that enable AI and hyperscale data centers, high-speed optical communications, advanced sensing applications, next-generation photonic integration, and more. Our team is collaborative and fast-moving, and you will have the opportunity to make meaningful contributions across technology, operations, and business growth.
If you are excited about solving challenging problems, advancing cutting-edge technology, and working with a highly collaborative team, we would love to hear from you.
Skills Required
- Ph.D. in Electrical Engineering, Applied Material Science, Applied Physics or related discipline
- 10+ years of relevant work experience (professional and PhD experience combined)
- Proven record of working across organization boundaries and driving complex programs to successful completion
- In-depth understanding of photonic integrated circuits and their components: lasers, modulators, amplifiers, detectors, passives, and optical coupling
- In-depth knowledge of opto-electronic device requirements for datacom and LiDAR applications
- Strong problem-solving, communication, organizational, interpersonal and presentation skills
- Hands-on experience with high-speed optical testing
- Hands-on experience with packaging
What We Do
OpenLight develops and manufactures custom Photonic Application-Specific Integrated Circuit (PASIC) chips using a heterogeneous silicon-photonics platform that integrates active and passive optical elements, including lasers, modulators, amplifiers, and detectors, on a single chip. Its production-ready technology supports high-performance, energy-efficient connectivity and applications spanning datacom, telecom, LiDAR, healthcare, high-performance computing, artificial intelligence, and optical computing across next-generation communications and computing networks.
