Senior Mechanical Engineer

Posted 2 Hours Ago
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Lake Forest, CA, USA
In-Office
Senior level
Artificial Intelligence • Hardware • Internet of Things • Machine Learning • Semiconductor • Automation • Manufacturing
The Role
Designs, tests, and qualifies electro-mechanical hardware subsystems for semiconductor and electronic-device handling and testing. Responsibilities include creating detailed drawings and bills of materials, conducting design reviews, developing test protocols, analyzing failures, implementing design changes, and creating fixtures and test equipment. The engineer collaborates with manufacturing, quality, suppliers, customers, and cross-functional product teams in an on-site environment.
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Job Summary & Responsibilities

Sr. Mechanical Engineer

Advantest Test Solutions, Inc. (ATS) is looking for a senior level Mechanical Engineer.  This individual will perform a broad range of mechanical engineering functions related to the design, testing, and evaluation of hardware sub-systems for handling and testing electronic systems including semiconductors, embedded devices and co-packaged optics (CPO) devices.  Develop and execute the detail design on new and/or modified existing designs in a fast-paced environment. Serve on product development team(s) and be assigned specific sub-assembly or sub-system mechanical design and testing responsibility. This role will require experience in electro-mechanical and automated systems, as can be found in leading semiconductor handlers and test systems.

Essential Duties and Responsibilities:

  • Design new and/or modify existing electro-mechanical assemblies to meet specific end customer requirements. Can include PCB Assys with multiple PCBs and heatsinks.
  • Complete all detail drawings, assembly drawings and Bills of Material for all initial manufacturing builds and eventual production level manufacturing.
  • Identify technical risk areas and optimization opportunities.
  • Present designs during internal Design Reviews.
  • Develop test specifications and evaluation protocols.
  • Perform electro-mechanical hardware, assembly and integration testing and final qualification testing.
  • Interpret functional test results and present findings to senior technical staff or vendors and customers.
  • Develop and implement mechanical design changes that are identified during testing or design verification review.
  • Develop new or modified test equipment, manufacturing and inspection jigs and fixtures, as required.
  • Work as part of a team that includes manufacturing, quality assurance and technical support organizations to establish functional specifications for components and to select vendors/suppliers for purchased parts, materials and assemblies.
  • Work closely with external Technology partners and successfully accomplishes common product design/ production goals.
  • All other duties as assigned.
Preferred Qualifications

Requirements, Education and Skills:

  • Requires a BS degree in Mechanical Engineering or similar.
  • Ideal candidates have 6 – 10+ years of experience, preferably in a high-technology environment.
  • Experience working in cross-functional teams that build complex electro-mechanical systems comprised of closed-loop motion control hardware, electrical and software components is required.
  • Experience in SolidWorks or similar 3D CAD system is required.
  • Experience in creating and interpreting mechanical detail and assembly drawings using ASME-Y14.5M GD&T standards is required.
  • Experience using CAD based FEA tools to check and optimize mechanical parts against structural requirements is required.
  • Experience in electronic packaging, testing and integrating thermal systems into automated equipment is also preferred.
  • Experience in failure prediction and analysis methods and processes like DFMEA, wishbone diagrams, 5 Whys or 8D Reports is required.
  • Knowledge of thermal dynamics and CFD experience may be required to perform air flow analysis or thermal analysis.
  • This is an on-site role in our Lake Forest, CA facility.

 

Additional Skills Preferred (but not required):

 

  • Experience with the architecting, design, certification and deployment of semiconductor capital equipment.
  • Experience with using PDM (MechWorks) Software tools to manage system hardware design configurations and documentation.
  • Experience with machine frame design and/or nineteen-inch electrical rack assembly design.
  • Experience using 3D printers to create fast prototype or demonstration parts and assemblies.
  • Contributed to the mechanical design and packaging of Co-Packaged Optics (CPO) modules, focusing on thermal management, EMI shielding, and optical alignment.
  • Participated in cross-functional design reviews involving mechanical, electrical, and thermal disciplines to meet performance and reliability targets.
  • Supported prototyping and testing of electro-mechanical assemblies, including load carrying performance, pressure distribution, environmental stress screening and vibration testing.
  • Collaborated with external partners to develop chillers, condenser units or HVAC systems.
  • Experience in semiconductor wafer handling, electrical device handling and/or factory automation equipment used in semiconductor device manufacturing or testing.

 

Skills Required

  • Bachelor’s degree in Mechanical Engineering or a similar field
  • 6–10+ years of mechanical engineering experience, preferably in a high-technology environment
  • Experience designing complex electro-mechanical systems with motion control, electrical, and software components
  • Experience with SolidWorks or a similar 3D CAD system
  • Experience creating and interpreting mechanical detail and assembly drawings using ASME Y14.5M GD&T standards
  • Experience using CAD-based FEA tools to evaluate and optimize mechanical parts
  • Experience with failure prediction and analysis methods, including DFMEA, wishbone diagrams, 5 Whys, or 8D Reports
  • Experience in electronic packaging, testing, and thermal-system integration
  • Knowledge of thermal dynamics and CFD experience for airflow or thermal analysis
  • Experience architecting, designing, certifying, and deploying semiconductor capital equipment
  • Experience using PDM software, such as MechWorks, for hardware configurations and documentation
  • Experience with machine-frame design or nineteen-inch electrical rack assembly design
  • Experience using 3D printers for rapid prototyping
  • Experience designing and packaging co-packaged optics modules, including thermal management, EMI shielding, and optical alignment
  • Experience supporting prototyping and testing of electro-mechanical assemblies, including vibration and environmental stress testing
  • Experience developing chillers, condenser units, or HVAC systems with external partners
  • Experience with semiconductor wafer handling, electrical device handling, or factory automation equipment
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The Company
HQ: Tokyo
2,006 Employees
Year Founded: 1954

What We Do

For over a half-century, Advantest has been designing innovative electronic measuring equipment and semiconductor test systems essential to the development and manufacture of advanced computer and telecommunications products. On April 1, 2012, Advantest completed its integration of Verigy Ltd. Additional Information about Advantest can be found at www.advantest.com.

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