Senior Embedded Development Engineer

Posted 22 Days Ago
Be an Early Applicant
Munich, Bayern, DEU
In-Office
Senior level
Artificial Intelligence • Software
The Role
Own the electrical design of UAV compute and avionics systems from architecture and component selection through schematic development, prototyping, debugging, validation, and flight testing. Responsibilities include PCB design, EMI/EMC troubleshooting, thermal and environmental analysis, hardware-in-the-loop validation, documentation, and system commissioning. The role collaborates with mechanical, software, and AI teams while leading reliable hardware development for autonomous platforms.
Summary Generated by Built In
🚀 Join SE3 Labs as Senior Embedded Development Engineer

Own the electrical brain of our autonomous systems, from schematics to flight. Early team, deep tech, high impact.

About SE3

SE3 Labs is building Spatial AI by combining 3D computer vision with large language models (LLMs). We believe the ability to reason about and act within physical space is foundational to unlocking the next generation of automation, from construction to smart infrastructure, and ultimately, defense.

Now, we’re building the physical platform to bring Spatial AI to life. That means high-performance, real-world robotic systems (starting with UAVs) and we’re looking for skilled, hands-on engineers who're ready to bring these machines into the real world.

About the Role

As Senior Embedded Hardware Development Engineer, you’ll own the complete electrical design of our UAV compute, sensor and avionic systems. From architecture to component selection, from first schematic to flight test, you’ll be in charge of engineering the electronic and firmware backbone of our spatial intelligence systems.

You’ll collaborate closely with mechanical, software, and AI teams, but this is your domain, and you’ll be trusted to build it right.

 
 
What You’ll Work On
  • Architecture & Design: Translate top level goals into requirements, then schematics and detailed designs for sensors, compute and communication across our flying platforms

  • Program & Bringup: Bring your design to life by developing and deploying the foundation layers of code in forms of firmware, drivers and operating systems

  • Prototype & Iterate: Build, rework, and test hardware with speed and precision, both in simulation and in flight

  • Optimize & Troubleshoot: Analyze designs via simulation and real-world testing, including EMI/EMC, thermal, power and performance

  • Validate in the Loop: Support hardware-in-the-loop and environmental validation workflows to ensure rugged, reliable designs

  • Document with Purpose: Keep clear records of requirements, tradeoffs, test results, tuning procedures, and design rationale

  • Technologies we use: NXP ARM SoCs, Nvidia Jetson, various NPUs, MIPI-CSI, GMSL, Linux, ROS, Altium Designer and more

 
 
Your Profile
  • You hold a M.Sc. in Electronics Engineering, Computer Science or a related discipline

  • You bring 5+ years of hands-on experience in mixed hardware development and software integration, from component selection and PCB design to low-level programming

  • You’re fully proficient in PCB layout tools and eCAD like Altium designer, and have a practical eye for clean, testable and maintainable designs

  • You’re confident with lab equipment (multimeters, oscilloscopes, spectrum analyzers, logic analyzers) and use them to diagnose and debug with purpose

  • You’re experienced in PCB-bringup, debugging, and ensuring they survive real-world use

  • You write and debug embedded firmware in C and/or C++, including peripheral drivers and interfaces between hardware and software

  • You’re familiar with hardware-in-the-loop and environmental testing, and understand how designs fail in the wild

  • You speak fluent English; German is a plus

  • Most importantly, you’re structured, fast-moving, and mission-driven. You don’t wait for perfection. You iterate until it works. You love building things that last.

 
 
Especially Valued Bonus Skills
  • Deep understanding of design and verification of EMC / robustness against EMI

  • Thermal design and analysis for compact electronics

  • RF integration and noise suppression

  • MIL-STD, DO-254, CRA and RED qualification experience

  • Automation of test rigs for HIL testing

 
 
Perks & Benefits
  • Real Ownership: Own product design and get equity early, real stock options to participate directly in SE3’s growth

  • AI-boosted workplace: We empower every employee with best-in-class AI tools and agents, giving you unlimited access to the latest advancements and a true productivity edge

  • Work Environment to Excel at: Find a high-quality and modern toolset, flat hierarchy and a skilled, driven team which will push the limits together with you

  • 31 Paid Days Off: 30 vacation days plus your birthday off

  • Well-being Access: Free membership to gyms, yoga, and wellness through EGYM Wellpass

  • Team Offsites: We go on 2 company retreats per year, our last ones were in Greece and Spain

  • Mentorship: Work closely with experienced engineers and get paired with a professional mentor to support your growth

 
 
Our Process
  1. Intro Call (30 min): Let’s get to know each other (conducted by Eugene, our Head of Talent)

  2. Technical Interview (45 min): (with Lukas, our Hardware Lead)

  3. Onsite Trial/Case (2 hrs): We’ll build or test something together, just like on the job (together with our Hardware Team)

  4. Team Dinner/Lunch: See if it’s a culture fit on both sides

Skills Required

  • M.Sc. or higher in Electronics Engineering, Computer Science, or a related discipline
  • 4+ years of hands-on experience in hardware development and software integration
  • Experience with component selection, PCB design, and microcontrollers
  • Deep understanding of EMC principles and practical EMI troubleshooting experience
  • Experience with PCB layout tools and 3D CAD
  • Proficiency with multimeters, oscilloscopes, spectrum analyzers, and near-field probes
  • Experience commissioning systems, debugging boards, and validating real-world reliability
  • Familiarity with hardware-in-the-loop and environmental testing
  • Fluent English
  • German language skills
  • Thermal design and analysis for compact electronics
  • RF integration and noise suppression
  • MIL-STD qualification experience
  • Battery and power system design experience
  • Automation of test rigs using SCPI or lab automation frameworks
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The Company
HQ: Munich
12 Employees
Year Founded: 2023

What We Do

We are a Spatial AI company developing technology that is able to understand and analyse the 3D world around us. We develop solutions that make complex information accessible through intuitive interfaces. Our Spatial AI drives innovation in sectors like defence, smart infrastructure, construction and smart factories. We develop intelligent solutions that increase efficiency and allow for deeper insights into processes and real-time situations.

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