1st Shift - Hours 7:00 AM to 4:30 PM

General Description:

The ideal Sr. Equipment Engineering candidate will have a proven track record in troubleshooting, diagnosing, and resolving complex electrical, mechanical, and 1-off tool failures associated with semiconductor manufacturing equipment. The selected candidate will have a strong background in cryo and vacuum equipment with some experience in flip chip bonders and metrology tools. He/she will act as the main point of contact for the ESG group in conversations centered around his/her primary tool set(s), having the ability through direct conversation with junior engineers, technicians, and inventory analysts, to identify and fill gaps in current documentation, best known methods (BKM), and parts inventory to assist in the mitigation of extended downtime scenarios related to customer tools. Must be able to work with ESG's inventory analyst to effectively identify, source, and secure critical, long lead time, and obsolete spares required to help extend the useful life of HRL's current fleet of tools. Will possess ability to dismantle, adjust, repair, and assemble equipment according to schematics, blueprints, drawings, and operating/repair manuals. Will have the ability to manage small projects, train other ESG staff and work independently at times. The engineer will develop and implement improvements to enhance reliability, performance, and long-term supportability of HRL’s equipment and infrastructure. 

Essential Duties:

Work in an ISO 4 Cleanroom environment 

Primary Tools Cryo and vacuum systems, flip chip bonders.

Secondary Tools Support systems (chillers, vacuum pumps, etc.) for semiconductor-processing equipment. Metrology tools.

Required Skills: 

Must be knowledgeable in the operational theory, advanced troubleshooting, and repair of cryo and vacuum equipment, flip chip bonders, and metrology equipment 

Having experience with high vacuum systems (theory, troubleshooting, and Helium leak detection for various pump packages) utilized in the processing of semiconductor substrates for testing modules is a plus

Must be proficient in capturing and reporting specific tool failures associated with primary responsibilities

Must have a proven track record of technical writing (maintenance and PM documentation/work instruction)

Experience with leading root cause/corrective action teams, establishing SPC, OCAP, and FMEA protocols is a plus

Required Education:

BS degree and min of 3yrs experience or,

AS degree and min of 5yrs experience or,

7-10 years of equivalent experience (Equivalent may consist of trade school experience, military background or OEM training on relevant equipment) 

Physical Requirements:

Must be able to work in a ISO Class 4 cleanroom and facility equipment rooms

While performing the duties of this job, the employee is regularly required to sit, talk or listen

The employee will spend a modest amount of time in meetings using computers 

The employee must be able to lift up to 50 pounds. Be able to stand; walk, stoop, kneel, crouch, or crawl

Special Requirements:

U.S. citizenship required. 

Secret Security Clearance required

If candidate does not have an active Top Secret clearance, he/she must have the ability to obtain one upon being hired.

Compensation:

The pay range for this position is $43.58 - $54.50 per hour + bonus + benefits.

Our ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.