Senior High-Speed Analog/RF System Architect (f/m/d)

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude
In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking a skilled Senior High-Speed Analog/RF System Architect at Black Semiconductor to own the analog, RF, and high-speed SerDes architecture of the CMOS SoCs powering our graphene photonic interconnect technology. You will define the electrical architecture at the boundary between electronics and photonics, including PLLs, TIAs, drivers, equalizers, ADC/DACs, and CDRs, translating system-level performance targets into scalable and manufacturable SoC solutions.

Working closely with the Photonics Circuit Designer, Package Electrical/SI Architect, analog design, and digital/EIC teams, you will drive architecture decisions across the complete electrical-to-optical channel. You will own system-level trade-offs across bandwidth, power, reach, cost, and manufacturability, while engaging directly with customers and product teams to translate deployment requirements into architectures and evaluate the impact and ROI of future features.

To join our team, you should be excited to

• Own the analog/RF and high-speed SerDes architecture for optical transceiver SoCs, defining solutions for drivers, TIAs, equalizers, ADC/DACs, PLLs, and CDRs targeting 112G/224G+ PAM4 and next-generation interconnects.

• Define and maintain Analog Product Requirement Specifications (PRS) per product, including architecture, verification plans, and performance, power, and area (PPA) estimates.

• Drive system-level link budget closure across the complete electrical-to-optical channel, accounting for transmitter impairments, channel loss, reflection, crosstalk, and receiver noise for Integrated Graphene Photonics (IGP)-enabled optical links.

• Own the Analog IP roadmap, aligning architecture direction with technology capabilities, EDA flows, and contractor/external design partnerships.

• Partner with the Photonics Circuit Designer, Package Electrical/SI Architect, and SoC design teams to reconcile analog/RF architecture decisions with PIC layout, package electrical constraints, and system requirements.

• Define Customer Requirement Documents (CRDs) for customer engagements and collaborate directly with customers to ensure architecture choices meet deployment requirements.

• Lead SoC concept and feasibility studies by exploring architectural options, driving system-level trade-offs, recommending final architectures, and supporting product teams in modeling use cases and ROI for candidate architectural features.

• Track and incorporate relevant interconnect standards, including PCIe, UCIe, CXL, and emerging die-to-die and optical standards, into architecture decisions.

Your Qualifications

• Ph.D. in Electrical Engineering or a related discipline with 5+ years of relevant experience, or a Master's degree with 8+ years of relevant experience (or equivalent demonstrated impact).

• Proven experience owning high-speed SerDes and analog/mixed-signal system architectures, including PLLs, TIAs, drivers, equalizers, ADC/DACs, and CDRs for 56G/112G/224G+ PAM4 systems in advanced CMOS technologies (FinFET/GAA).

• Strong system-level architecture experience, including taking heterogeneous SoCs from concept through architecture sign-off, ideally involving advanced packaging technologies such as 2.5D/3D integration.

• Expertise in electrical-optical link budget analysis, including transmitter impairments, channel loss, reflection, crosstalk, and receiver noise considerations.

• Hands-on experience characterizing high-speed analog/RF designs using modern lab equipment, including BERTs, high-speed oscilloscopes, and VNAs.

• Strong understanding of high-speed interconnect standards, including PCIe, UCIe, and CXL, and their influence on analog/RF architecture decisions.

• Ability to collaborate across domains, working closely with photonic circuit designers, package engineers, digital designers, product teams, and customers to resolve complex architecture trade-offs.

• Strong technical communication skills, with the ability to translate customer deployment requirements into architecture specifications and communicate complex design decisions across technical and business stakeholders.

• Experience with analog/mixed-signal design, system modeling, and architecture tools, including Cadence Virtuoso/Spectre, MATLAB/Simulink, Keysight ADS, HSPICE, Ansys HFSS/SIwave, Python-based modeling and automation workflows, and high-speed lab measurement environments.

• Experience with silicon photonics or electro-optic interface design, analog design team leadership, system-level SerDes/optical link modeling, or semiconductor product development including reliability and qualification requirements is considered a plus.

Our work culture

People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters

Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development

Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future

We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward

We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry

If your application results in an employment relationship, your Applicant Data will be transferred to our personnel records and processed in accordance with applicable legal requirements; otherwise, your Applicant Data will be retained for up to six (6) months after completion of the recruitment process. Read more about our privacy policy here.