You will be the Semiconductor Process Engineering Mgr for the Advanced Focal Plane Array Production Team. Our team is responsible for supporting production operations, developing and optimizing semiconductor processes, managing equipment procurement, and driving yield and efficiency for Advanced Focal Plane arrays.
What You Will be Doing
As the Semiconductor Process Engineering Mgr you will be responsible for leading a high‑mix production team that fabricates cutting‑edge infrared sensor arrays. Your responsibilities will include, but are not limited to:
- Directing wicking, plasma cleaning, wirebonding, substrate thinning, dicing, AR coating, and flip‑chip bonding processes.
- Developing and optimizing process flows, tooling, and equipment to maximize yield, efficiency, and throughput.
- Collaborating with development and integration engineers to introduce new capabilities and lead capital procurement projects.
- Analyzing test data, identifying trends, and implementing corrective actions for process control.
- Creating and maintaining documentation, work instructions, and process control checklists.
Why Join Us
The ideal candidate is a collaborative technical leader who thrives in a fast‑paced environment and is passionate about advancing FPA technology. This role offers the chance to shape critical manufacturing processes, mentor a skilled team, and make a tangible impact on next‑generation infrared sensors.
We are committed to supporting your work‑life balance and overall well‑being, offering flexible scheduling options. Learn more about Lockheed Martin’s comprehensive benefits package here
Further Information About This Opportunity
This position is located in Goleta, CA. Discover more about Lockheed Martin Missiles and Fire Control Santa Barbara Focal Plane here.
MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance.
- Bachelors degree from and accredited college in Engineering, Physics, or related experience
- Minimum of 8 years of experience in semiconductor packaging or FPA manufacturing in a clean room environment with technical understanding of epoxy die attach/bonding, polishing, or Anti-Reflection Coating
- Minimum of 5 years of technical team leadership experience.
- Must be a US Citizen as this position is located in a facility that requires special access.
- Advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering or Physics with more than 10 years of industry experience
- Background in IR FPA packaging, specifically flip-chip hybridization techniques.
- Knowledge of semiconductor device physics, photodetectors, and FPAs.
- Proficiency in MS Office (Word, PowerPoint, Excel).
- Excellent engineering documentation skills and communication skills.
- Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff.
- Experience leading multifunctional teams.
- Ability to multi-task, organize and prioritize assignments independently.
- Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).
- Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.
- Background in IR FPA packaging, specifically flip-chip hybridization techniques.
- Knowledge of semiconductor device physics, photodetectors, and FPAs.
- Proficiency in MS Office (Word, PowerPoint, Excel).
- Excellent engineering documentation skills and communication skills
- Experience in developing skill sets of subordinates, situational leadership, and high emotional IQ.
Pay Information
Full-Time Salary Range: $166900.00 - $309900.00
At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.
The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.
Benefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.
- Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
- For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.
Skills Required
- Bachelor's degree from an accredited college in Engineering, Physics, or a related field or equivalent related experience
- At least 8 years of experience in semiconductor packaging or focal plane array manufacturing in a cleanroom environment
- Technical understanding of epoxy die attach and bonding, polishing, or anti-reflection coating
- At least 5 years of technical team leadership experience
- Must be a U.S. citizen
- Must be able to obtain a Secret security clearance
- Advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics
- More than 10 years of industry experience
- Experience with infrared focal plane array packaging and flip-chip hybridization techniques
- Knowledge of semiconductor device physics, photodetectors, and focal plane arrays
- Proficiency in Microsoft Word, PowerPoint, and Excel
- Excellent engineering documentation, written communication, verbal communication, and interpersonal skills
- Experience leading multifunctional teams
- Ability to multitask, organize, and prioritize assignments independently
- Experience with Design of Experiments, statistical process control, and data analysis software such as JMP
- Experience with Lean Six Sigma methodologies and data analysis software such as MATLAB or JMP
- Experience developing subordinate skill sets, situational leadership, and emotional intelligence
Lockheed Martin Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Lockheed Martin and has not been reviewed or approved by Lockheed Martin.
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Retirement Support — Retirement benefits are described as a standout element, with a strong 401(k) program and options like an employee stock purchase plan. Feedback suggests these features meaningfully enhance total compensation and long‑term financial security.
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Healthcare Strength — Healthcare coverage is portrayed as comprehensive from day one, with multiple plan options, mental health resources, and virtual care. Wellness supports such as on‑site services and preventive programs are also highlighted.
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Flexible Benefits — Work arrangements often include compressed schedules and telework, contributing to a favorable work‑life balance. Feedback suggests this flexibility is a key reason many view the overall package positively.
Lockheed Martin Insights
What We Do
Customer Focus, Innovation and Purpose are Built Into Everything We Do. Lockheed Martin. Your Mission is Ours ™. Headquartered in Bethesda, Maryland, Lockheed Martin is a global security and aerospace company principally engaged in the research, design, development, manufacture, integration and sustainment of advanced technology systems, products and services.
