Quality Engineer - Microelectronics (BGA Re-Balling)

Posted 3 Hours Ago
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Round Rock, TX, USA
In-Office
Mid level
Hardware
The Role
Develops and maintains quality controls for BGA re-balling and rework processes. Conducts inspections, audits, process analysis, failure investigations, and CAPA activities. Ensures compliance with IPC, IEC, customer, and quality-system requirements; supports supplier quality; maintains inspection and validation records; and trains operators and technicians on inspection standards. Requires microelectronics quality experience, BGA re-balling expertise, X-ray inspection knowledge, and familiarity with statistical and quality-management tools.
Summary Generated by Built In

Key Responsibilities:

Develop, implement, and maintain quality control procedures specific to BGA re-balling and rework processes.

Monitor and analyze process performance metrics to identify trends, root causes, and opportunities for continuous improvement.

Conduct first article inspections (FAI), in-process audits, and final inspections of re-balled BGA components.

Collaborate with engineering and production teams to ensure process capability and repeatability.

Lead failure analysis and corrective/preventive action (CAPA) activities related to BGA re-balling defects.

Maintain compliance with IPC standards (e.g., IPC-7711/7721, IPC-A-610), IEC TS 62647-4, and customer-specific requirements.

Support supplier quality initiatives for incoming BGA components and solder materials.

Document and maintain quality records, inspection reports, and process validation data.

Train operators and technicians on quality standards and inspection techniques for BGA re-balling.

Qualifications:

IMPORTANT INFORMATION: This position is in an ITAR-registered facility, US Person (US Citizen or US Permanent resident) status is a must.

Bachelor’s degree in Engineering, Materials Science, or a related technical field is a plus.

Minimum 3 years of experience in a quality engineering role within the microelectronics or semiconductor industry.

Hands-on experience with BGA re-balling, X-ray inspection, soldering standards, and rework techniques.

Strong knowledge of IPC standards and electronic component handling.

Proficiency in statistical analysis tools (e.g., Minitab, JMP) and quality systems (e.g., ISO 9001, AS9100).

Excellent problem-solving, communication, and documentation skills.

Preferred Skills:

Experience with automated optical inspection (AOI) and X-ray inspection systems.

Familiarity with ESD controls.

Six Sigma Green Belt or higher certification is a plus.

Why Join Us?
Work with cutting-edge microelectronic technologies.
Be part of a collaborative and innovative team.
Opportunities for professional growth and certification.
Competitive salary and benefits package.

Qualifications Education Required Bachelors or better. Experience Required Minimum 3 years Equal Opportunity Employer/Protected Veterans/Individuals with Disabilities
This employer is required to notify all applicants of their rights pursuant to federal employment laws. For further information, please review the Know Your Rights notice from the Department of Labor.

Skills Required

  • US Person status: US Citizen or US Permanent Resident
  • Bachelor's degree in Engineering, Materials Science, or a related technical field
  • Minimum 3 years of experience in a quality engineering role within the microelectronics or semiconductor industry
  • Hands-on experience with BGA re-balling, X-ray inspection, soldering standards, and rework techniques
  • Strong knowledge of IPC standards and electronic component handling
  • Proficiency with statistical analysis tools such as Minitab or JMP
  • Knowledge of quality systems such as ISO 9001 and AS9100
  • Problem-solving, communication, and documentation skills
  • Experience with automated optical inspection and X-ray inspection systems
  • Familiarity with ESD controls
  • Six Sigma Green Belt or higher certification
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The Company
HQ: Orlando, FL
335 Employees
Year Founded: 1978

What We Do

Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for over 40 years, our extensive hi-reliability capabilities serve the global Aerospace & Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.com Micross'​ Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise. For additional information, visit www.sts-usa.com

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