Program Manager

Posted 3 Hours Ago
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Apopka, FL, USA
In-Office
Senior level
Hardware
The Role
Manage complex semiconductor packaging programs from planning through delivery, overseeing cost, schedule, technical performance, customer requirements, proposals, contracts, resources, and financial forecasts. Lead cross-functional engineering, manufacturing, and administrative teams; support business development, customer communication, qualification efforts, and program problem resolution. Requires experience in semiconductor packaging, DOD or aerospace programs, military and space standards, earned value management, and government procurement processes. Occasional travel is required.
Summary Generated by Built In

The Program Manage coordinates and monitors the scheduling, pricing, and technical performance of company programs. Responsibilities also include aiding in the negotiation of contracts and contractual changes and coordinating preparations of proposals, plans, specifications, and financial conditions of contracts. Develops new business and expands product line. Ensures adherence to master plans and schedules develops solutions to program problems, and directs work of incumbents assigned to program from various departments. Ensures projects are completed on time and within budget. Acts as advisor to program team regarding projects, tasks, and operations. Familiar with standard concepts, practices, and procedures within a particular field. Relies on extensive experience and judgment to plan and accomplish goals. Performs a variety of complex tasks. A certain degree of creativity and latitude is required.

Essential Duties & Responsibilities:

  • Managing a portfolio of complex programs from Program Planning, to execution and delivery, while maintaining program ownership. Translate customer requirements into manufacturable product specs and ensure timely delivery.
  • Collaborate with design and process engineers to develop and integrate packaging solutions.  Lead qualification efforts. 
  • Ensuring customer satisfaction, maintaining customer communication, and providing overall management of the customer relationship including fully comprehend customer’s technical, quality, documentation and schedule requirements
  • Managing the cost, schedule, and technical performance requirements of multiple programs through all phases from inception to completion
  • Directing the preparation of proposals, business plans, proposal work statements and specifications, operating budgets, and financial terms/conditions of contracts
    Ensuring that all resources such as engineering, manpower, production, and facilities are available to support the program
  • Participating in defining program parameters or guiding internal research and development efforts
  • Working with customers to determine needs, requirements, and new business opportunities
  • Directing the work of employees assigned to the program from technical, manufacturing, and administrative areas
  • Solving highly complex problems with significant business impact
  • Interacting internally with management and customers on significant business matters
    Developing, managing, tracking, and reporting financial forecasts
  • Understanding customer procurement processes and government funding approval
  • Making effective decisions regarding the profitability and achievability of pursuits
  • Experience and knowledge in Military/space and JEDEC documentations, inspections and reliability requirements
  • Occasional travel required

 Job Qualifications:

  • Bachelor’s Degree in Engineering, Business, or technical field with a minimum of 7 years of prior related experience in Semiconductor Packaging industry.  PMP certification is a plus.
  • Experience managing programs within a DOD or Aerospace environment
  • Solid technical background and strong financial skills
  • Previous Earned Value Management System experience
  • Experience leading cross-matrix teams and working with other teams, business units, and customers
  • Experience with customer and stakeholder communication
  • Experience within the space and mil/aero industries, strongly preferred
  • Knowledge of MIL-Specs/Stds, ITAR, and export regulations a plus
  • Strong organizational and interpersonal skills
  • Excellent oral, written, negotiation, and presentation skills

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.  

www.Micross.com

Qualifications Education Required Bachelors or better. Experience Required 7 years of prior related experience in Semiconductor Packaging industry Equal Opportunity Employer
This employer is required to notify all applicants of their rights pursuant to federal employment laws. For further information, please review the Know Your Rights notice from the Department of Labor.

Skills Required

  • Bachelor’s degree in Engineering, Business, or a technical field
  • At least 7 years of related experience in the semiconductor packaging industry
  • Experience managing programs in a DOD or aerospace environment
  • Solid technical background and strong financial skills
  • Earned Value Management System experience
  • Experience leading cross-matrix teams and collaborating with business units and customers
  • Customer and stakeholder communication experience
  • Strong organizational and interpersonal skills
  • Excellent oral, written, negotiation, and presentation skills
  • Experience in space and military/aerospace industries
  • Knowledge of MIL-Specifications and standards, ITAR, and export regulations
  • PMP certification
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The Company
HQ: Orlando, FL
335 Employees
Year Founded: 1978

What We Do

Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for over 40 years, our extensive hi-reliability capabilities serve the global Aerospace & Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.com Micross'​ Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise. For additional information, visit www.sts-usa.com

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