Process Engineer 5

The Customer Support Business Group (CSBG) delivers industry-leading support and lifecycle solutions that help customers maximize the performance, productivity, reliability, and safety of their semiconductor manufacturing operations. By combining deep technical expertise with close customer collaboration, CSBG enables customers to achieve their technology and business objectives throughout the lifecycle of their equipment.

Within CSBG, Reliant Etch Technology develops advanced etch solutions for specialty semiconductor and advanced packaging applications. Our team works at the forefront of innovation, enabling next-generation technologies including 3D integration, HBM, heterogeneous packaging, and AI-driven computing.

As a Process Engineer at Lam, you will play a key role in advancing the technologies that power the AI era. Your expertise will help customers solve complex manufacturing challenges, accelerate technology adoption, and bring next-generation semiconductor and advanced packaging solutions from concept to production.

Through innovation, technical leadership, and close customer engagement, you will directly influence the development of breakthrough processes that enable future generations of high-performance computing, memory, and advanced packaging technologies.

• Develop and optimize advanced etch processes for specialty semiconductor and advanced packaging applications.
• Design, execute, and analyze experiments to drive process development and improve performance, yield, and productivity.
• Define process and hardware requirements to meet evolving technology and customer needs.
• Analyze process and experimental data to establish robust process windows and solve complex technical challenges.
• Plan, execute, and present results from customer demonstrations and technology evaluations.
• Collaborate with customers and cross-functional teams to develop innovative solutions and support technology roadmaps.
• Contribute to next-generation product development and technology releases.
• Drive the introduction and adoption of new semiconductor manufacturing technologies at customer sites worldwide.

• Bachelor's degree with 12+ years of related industry experience; or
• Master's degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field with 8+ years of industry experience; or
• PhD in a relevant technical discipline with 5+ years of industry experience; or
• An equivalent combination of education and professional experience.

• Strong experience in semiconductor process development, including etch, deposition, dielectric, conductor, and metal film technologies.
• Deep understanding of advanced packaging technologies and integration schemes.
• Hands-on experience with frame-form plasma dicing technologies, including wafer handling systems, process integration, and plasma etch development.
• Strong background in plasma physics and plasma processing technologies, including Reactive Ion Etching (RIE), Inductively Coupled Plasma (ICP), and Capacitively Coupled Plasma (CCP).
• Experience with deep silicon etch, plasma dicing, TSV, HBM, 3D integration, or related advanced packaging technologies.
• Knowledge of material synthesis, surface modification, and materials characterization techniques.
• Proficiency in statistical analysis, Design of Experiments (DOE), and structured problem-solving methodologies.
• Demonstrated ability to work effectively in a highly collaborative, cross-functional environment with engineering teams, customers, and external partners.
• Strong communication and presentation skills, with the ability to influence technical decisions and customer adoption strategies.
• Proven track record of delivering innovative process solutions from development through production implementation.

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

#LI-LE1