Principal RFIC Design Engineer

Posted 2 Days Ago
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Paterna, Valencia, Comunidad Valenciana, ESP
In-Office
Expert/Leader
Software
The Role
Leads architecture, design, simulation, verification, integration, tapeout, silicon bring-up, characterization, and production of complex RF, analog, data-converter, SerDes, and mixed-signal ICs. Owns critical RFIC blocks, drives top-level sign-off and silicon investigations, collaborates on RF layout and electromagnetic analysis, defines production-test strategies, and mentors engineers while guiding technical decisions and methodology improvements.
Summary Generated by Built In
Responsibilities

We are looking for an experienced Principal RFIC Design Engineer to take a leading technical role in the development of highly integrated RF and mixed-signal ICs.

The ideal candidate combines deep hands-on circuit-design expertise with strong system understanding and a proven ability to drive complex designs from architecture and specification through implementation, verification, silicon bring-up, and production. The role has significant influence on RF architecture, technical decisions, design methodology, and the development of the broader RFIC team. The main responsabilities are the following:

  • Lead the architecture, design, simulation, and verification of complex RF, analog baseband, data-converter, SerDes, and mixed-signal circuits
  • Own critical RFIC blocks from specification through tapeout, silicon bring-up, characterization, production, and simulation-to-measurement correlation
  • Design and/or technically lead circuits such as LNAs, PAs, mixers, VGAs, RF front ends, ADCs, DACs, filters, analog baseband signal-processing chains, SerDes analog front ends, PLLs and frequency synthesizers, VCOs and DCOs, clock-generation and distribution circuits, biasing, and power-management circuitry
  • Translate system-level requirements into circuit specifications, architectures, verification plans, and robust designs across PVT, mismatch, noise, linearity, stability, dynamic range, power, and reliability
  • Lead RFIC top-level integration and sign-off across RF, analog, digital, package, PCB, and power domains, including supply coupling, spurs, isolation, and signal integrity
  • Partner with layout engineers on RF-aware layout, parasitic optimization, EM analysis, extraction, and post-layout verification
  • Work with validation, test, and product engineering to define characterization, calibration, ATE, and production-test strategies for high-volume manufacturing
  • Lead complex silicon investigations, identify root causes, and drive issues to resolution during bring-up and productization
  • Provide technical guidance and mentorship through design reviews, methodology improvements, and cross-functional technical alignment
Qualifications
  • BSc, MSc, or PhD in Electrical or Electronic Engineering, or a related field, with a minimum of 10 years of industry experience in RFIC or analog/mixed-signal IC design and demonstrated ownership of complex designs that reached production silicon
  • Strong RF and analog fundamentals, including noise, linearity, matching, stability, feedback, device modeling, process variation, data-converter performance, and analog baseband signal processing
  • Hands-on design experience across several RF, data-converter, SerDes, frequency-generation, or analog baseband blocks, such as LNAs, PAs, mixers, VGAs, ADCs, DACs, filters, variable-gain signal chains, SerDes analog front ends, PLLs, VCOs, and DCOs
  • Solid experience with Cadence Virtuoso/Spectre or equivalent environments and with relevant verification methods, including S-parameters, PSS/PAC/PNOISE, transient noise, and data-converter or baseband performance analysis
  • Strong understanding of layout-dependent effects, parasitic extraction, EM effects, RF layout optimization, and post-layout verification
  • Experience developing high-volume integrated products in advanced CMOS technologies for wireless connectivity, wireline communications, data conversion, SerDes, networking, or other complex analog and mixed-signal applications
  • Practical understanding of on-chip LDOs, biasing, calibration, package and PCB interactions, ATE, production test, and high-volume manufacturing
  • Strong analytical, silicon-debug, technical decision-making, and cross-disciplinary communication skills
  • Strong written and verbal communication skills in English
Compensation and Benefits
  • Competitive Salary Package
  • Stock-based compensation
  • Private Medical Insurance 
  • Life Insurance
Company Overview

MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the world’s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications.


We hire the best people in the industry and engage them in some of the most exciting opportunities that connect the world we live in today. Our growth has come from innovative, bold approaches to solving some of the world’s most challenging communication technology problems in the most efficient and effective manner.


MaxLinear began by developing the world’s first high-performance TV tuner chip using standard CMOS process technology. Others said we couldn’t achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. Since then, we’ve developed a full line of products that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments. Over the years, we’ve expanded through organic growth and through several acquisitions that have perfectly complemented our existing portfolio and enabled us to deliver complete end-to-end solutions in our target markets. One such example was the acquisition of Intel’s Home Gateway Platform Division that added Wi-Fi, Ethernet, and Broadband Gateway Processor SoC technology to our connected home portfolio creating a complete and scalable platform of connectivity and access solutions to fully address our customers’ needs.


Our headquarters are in Carlsbad, near San Diego, California. We also have major design centers in Irvine and San Jose, California; Valencia, Spain; Bangalore, India; Munich, Germany; Israel; and Singapore.


We have approximately 1,200 employees, a substantial majority of whom have engineering degrees and include masters and Ph.D. graduates from many of the premiere universities around the world. Our employees thrive on innovation, outstanding execution, outside-the-box thinking, nimbleness, and collaboration. Together, we form a high-energy business team that is focused on building the best and most innovative products on the market.

Skills Required

  • BSc, MSc, or PhD in Electrical Engineering, Electronic Engineering, or a related field
  • Minimum 10 years of industry experience in RFIC or analog/mixed-signal IC design
  • Demonstrated ownership of complex designs that reached production silicon
  • Strong RF and analog fundamentals, including noise, linearity, matching, stability, feedback, device modeling, process variation, data-converter performance, and analog baseband signal processing
  • Hands-on design experience across several RF, data-converter, SerDes, frequency-generation, or analog baseband circuit blocks
  • Experience with Cadence Virtuoso, Spectre, or equivalent design environments
  • Experience with S-parameters, PSS, PAC, PNOISE, transient noise, and data-converter or baseband performance analysis
  • Strong understanding of layout-dependent effects, parasitic extraction, electromagnetic effects, RF layout optimization, and post-layout verification
  • Experience developing high-volume integrated products in advanced CMOS technologies
  • Practical understanding of on-chip LDOs, biasing, calibration, package and PCB interactions, ATE, production testing, and high-volume manufacturing
  • Strong analytical, silicon-debug, technical decision-making, and cross-disciplinary communication skills
  • Strong written and verbal communication skills in English
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The Company
HQ: Carlsbad, CA
1,442 Employees
Year Founded: 2003

What We Do

As a global market innovator, MaxLinear (NASDAQ:MXL) partners with leading customers worldwide to shape the future of networking and communications technology that drive smarter, faster networks. We make multi-gig connectivity a reality through our digital, analog, radio frequency (RF) and mixed signal integrated circuits and software system solutions. Whether fiber, wireless or broadband infrastructure, data centers, inside your home or industrial IoT, MaxLinear products maximize speed and efficiency while lowering power consumption of networks. As a fabless system-on-chip (SOC) product company, MaxLinear began in 2003 by developing the world’s first high-performance TV tuner chip using standard CMOS process technology. Others said we couldn’t achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. We continue with the “can-do” attitude and innovations that lead in markets for access and connectivity, wired and wireless infrastructure, data center connectivity, and industrial and multi-market applications. Our products are at the heart of technologies around you, driving faster and more intelligent networks. We have solutions that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments.

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