PCB Engineer

The Anduril Battlespace Awareness Radar team develops state-of-the-art radar systems, deployed to tackle the most significant security challenges of America and its allies. The Radar team is seeking a Junior PCB Design Engineer to transform ambitious concepts into manufacturable reality for the next generation of US radars. The Radar team is responsible for all aspects of radar system development, from the ideation stage through initial production.  In this role, you will work closely with an interdisciplinary technical team to route high-speed mixed-signal designs, interact with fabricators and assemblers, and manage signal integrity in complex PCBs.

• Work directly with engineers to produce printed circuit board designs supporting Anduril’s products.
• Apply modern design standards and guidelines to create high-reliability, highly manufacturable assemblies.
• Implement combinations of high-speed digital, precision analog, RF, and high-power designs.
• Lead the team in establishing internal guidelines for design for manufacturing (DFM), design for assembly (DFA), and overall quality fabrication and assembly outputs.
• Develop and refine team processes for PCB design, part creation, and library/database standards.
• Coordinate external PCB design resources during design surges.
• Work in a fast-paced environment, having to juggle multiple concurrent projects and customers.

• Bachelor’s degree in electrical engineering or similar and 4+ years of professional experience in PCB design.
• Ability to read and interpret schematics and apply best practices appropriate for each design.
• Expertise in applying relevant IPC standards, CID, CID+ certification.
• Expertise in PCB fabrication processes, limitations, design rules, and best practice.
• Experience using Altium Designer CAD tools (Allegro is a plus).
• Experience with developing component libraries and library management.
• Excellent communication skills with multiple fab houses (ensuring boards are built to print).
• Excellent communication skills with multiple assembly houses (ensuring boards are built to BOM).
• Experience with a variety of board types, including high density and high layer count (greater than 16) digital designs, power electronics, flex circuits, and RF circuits.
• Experience with HDI (high density interconnect) and thicker boards (greater than 1.6mm).
• Experience with high speed digital interfaces and controlled impedance routing requirements like USB, PCIe, Ethernet, SERDES, and DDR memory.
• Eligible to obtain and maintain an active U.S. Secret security clearance

• Familiar with RF board design.
• Experience with high-pin count packages (FPGA fanout).
• Familiar with basic signal and power integrity rules (how they affect layout).

We request transcripts as part of the early application process to understand your academic background and how your coursework supports the skills deemed critical for the role. Transcripts help us assess your technical and analytical abilities, complementing our interview process in which we also evaluate practical experience and cultural fit. If you choose not to share your transcripts, you will need to provide detailed information regarding your academic performance in relevant courses, including projects and coursework specifics, to ensure we evaluate your academic accomplishments properly. If you do provide academic transcripts, feel free to redact non-technical information (e.g., student ID, dates, non-technical coursework, etc.). Unofficial transcripts obtained online acceptable for this assessment.