The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.
Join us as a Manufacturing Failure Analysis Engineer, where you'll play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products. The ideal candidate brings hands-on experience in probing, strong understanding of device behavior, and the ability to independently execute complex debug workflows.
Business group
You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future.
Key Responsibilities:
• Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes.
• Perform electrical probing and advanced characterization on silicon devices (wafer-level and site-specific structures)
• Set up, operate, and troubleshoot probe stations and electrical measurement systems.
• Execute complex test plans and interpret schematics, layouts, and device structures to support failure analysis workflows.
• Analyze electrical data (e.g., IV, CV, leakage, shorts/opens) to support fault isolation and root cause identification.
• Partner with FA engineers to integrate probing with SEM, FIB/PFIB, and TEM-based workflows.
• Drive improvements in probing methods, workflows, and best-known methods (BKMs)
• Provide technical guidance to junior engineers and technicians on probing techniques and lab practices.
• Support tool ownership activities including troubleshooting, calibration, and uptime improvement.
• Participate in lab sustaining, process transfer, and cross-functional yield improvement initiatives.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.
Minimum Qualifications:
• Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM fields.
• 2+ years of hands-on experience with TEM or FIB or SEM or nanoprobing instrumentation in a lab or applications setting in other techniques OR 2+ years of experience in a lab setting where samples are prepared for analysis.
• US citizenship required.
• Ability to obtain and maintain a US Government Security Clearance.
Preferred Qualifications:
• MS, or PhD in Materials Science, Physics, Engineering or related STEM fields
• Possibility of working a shifted schedule with at least one weekend day at least two weeks a month. (Sunday-Thursday or Tuesday-Saturday)
• Knowledge of semiconductor process fundamentals and the advances in fabrication technology over the past decade.
• Knowledge or direct experience with general failure analysis tools in a semiconductor laboratory.
• Demonstrated independent quick-learning ability on lab instrumentation.
• Excellent verbal and written communication skills.
• Demonstrated ability to lead and manage lab staff.
• Prior experience working with US Government contracts including security and sensitive document handling and/or Top-Secret US Government clearance.
• Active US Government Security Clearance, with a minimum of Secret level.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $103,730.00-170,630.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM field
- 2+ years hands-on experience with TEM or FIB or SEM or nanoprobing instrumentation OR 2+ years experience preparing samples for analysis in a lab setting
- US citizenship required
- Ability to obtain and maintain a US Government Security Clearance
- Experience operating probe stations and electrical measurement systems; probing and electrical characterization (IV, CV, leakage, shorts/opens)
- MS or PhD in Materials Science, Physics, Engineering or related STEM fields
- Knowledge of semiconductor process fundamentals and failure analysis tools in a semiconductor laboratory
- Prior experience with US Government contracts, security/sensitive document handling, or active Top-Secret/Secret clearance
- Demonstrated ability to lead and manage lab staff and strong verbal/written communication skills
- Willingness/ability to work a shifted schedule including at least one weekend day two weeks a month
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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