岗位职责：
1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护；
2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良；
3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控；
4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升；
5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。
任职基本要求：
1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；
2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；
3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；
4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件；
加分项：
熟悉车载芯片塑封工艺、抗潮耐温塑封制程经验优先。
About Us- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
Skills Required
- Bachelor's degree or above in Microelectronics, Electronic Information, Materials Engineering, Mechanical Automation, Measurement and Control, or related engineering field
- 3+ years production experience in semiconductor packaging and test factory (mass production)
- Familiarity with semiconductor packaging process flow and production line operations
- Experience with production SOPs, abnormality analysis, 8D reports, and yield optimization processes
- Experience in molding material verification and curing process optimization, and control of product appearance and electrical consistency
- Ability to independently interface with production, R&D, and quality for cross-functional collaboration
- Familiarity with cleanroom production standards
- Willingness to support production shift schedules and emergency overtime
- Proficient in Microsoft Office
- Experience with automotive-grade molding processes and moisture/temperature resistant molding (anti-moisture, high-temp) for automotive chips
Texas Instruments Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Texas Instruments and has not been reviewed or approved by Texas Instruments.
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Strong & Reliable Incentives — Profit sharing and annual bonuses are portrayed as a meaningful, formula-linked upside that can materially lift total earnings in strong years. An employee stock purchase plan with a discount further reinforces recurring, wealth-building incentives.
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Retirement Support — A 401(k) match is described as a stable core benefit, with some references to additional legacy employer contributions and even pension-like elements for certain cohorts. This framing positions long-term savings support as a notable part of the overall rewards package.
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Healthcare Strength — Medical coverage is depicted as broadly comprehensive, with preventive care and access to HSA/FSA features cited as value-adds. Company-seeded HSA contributions are repeatedly characterized as an important offset to the plan design for those enrolled.
Texas Instruments Insights
What We Do
Texas Instruments develops semiconductor and computer technology for cellular handsets, digital signal processors and analog semiconductors. Texas Instruments has been making progress possible for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Our more than 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It’s what we do and have been doing for decades. Learn more https://news.ti.com/index.cfm
