MEMS Engineer (m/f/d)

Posted Yesterday
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2 Locations
Hybrid
33K-33K Annually
Entry level
Aerospace • Artificial Intelligence • Cloud • Machine Learning • Software • Cybersecurity • Defense
In an era of dynamic change, Aerospace is addressing the most complex challenges in space.
The Role
Design, model, simulate, test, and integrate MEMS sensors and packages for navigation, control, and stabilization systems. Responsibilities include sensor and package specifications, control-loop and analog circuit design, multiphysics modeling, co-design, foundry and supplier coordination, prototype characterization, environmental and reliability testing, failure analysis, verification, qualification, and design documentation. The role collaborates across ASIC, FPGA, PCB, firmware, software, packaging, process, and test engineering teams.
Summary Generated by Built In

Civitanavi Systems is a leading player in the design, development and manufacture high-tech solutions of Navigation, Control and Stabilization Systems, for several applications, in Aerospace Defense and Industrial sectors. The application of proprietary methods and technologies, based on FOG (Fiber Optic Gyroscope) and MEMS (Micro Electro-Mechanical Systems) technology, enables the company to best meet the specific needs of its customers. 

Founded as a start-up in 2012 in Italy and recognized as an innovative SME in 2017, Civitanavi has joined the Honeywell Group as of August 2025.

Our MEMS team is looking for a MEMS and ASIC Designer to join the company in the Turin’s office or headquarter in Porto Sant’Elpidio, and take responsibility for the design, development, test and integration of MEMS sensors to be embedded transversally in CNS’ systems. This opportunity is addressed to engineers with a background in Electronics or equivalent scientific background.

Responsibilities
  • The selected candidate will join the HW team working on MEMS-based products and will collaborate with ASIC, system, FPGA, PCB, firmware, software, packaging, process and test engineers.
  • Translate product and system requirements into MEMS sensor and package specifications, architectures and verifiable design requirements.
  • Design, model and simulate control loops of MEMS sensing structures.
  • Desing the analog circuits to control the MEMS sensor.
  • Define and develop package concepts for MEMS devices, considering mechanical support, stress management, thermal behavior, vacuum or controlled atmosphere, interconnections, sealing, contamination control and compatibility with assembly processes.
  • Assess the interaction between MEMS structures and package through mechanical, thermal and multiphysics modeling, and drive sensor-package co-design to minimize performance degradation.
  • Coordinate interfaces with foundries, packaging suppliers and assembly partners, supporting process selection, design rules, tolerancing, prototype fabrication and industrialization.
  • Define and support verification plans, prototype characterization, environmental and reliability testing, failure analysis and interpretation of results at die, package and product level.
  • Contribute to design reviews, risk analysis, design-for-manufacturing, design-for-test, yield improvement and qualification activities.
  • Generate and maintain sensor and package design documentation, models, interface specifications, verification reports and requirements traceability.
Qualifications
  • Master’s degree in Electronics, Microelectronics, Physics, Materials Science or a related discipline, with relevant experience in MEMS development.
  • Knowledge of MEMS sensing principles, micromechanics, electrostatic or other transduction mechanisms, and the main performance and error sources of MEMS sensors.
  • Experience in the design, modeling and simulation of control loops for MEMS structures using finite-element, multiphysics and dedicated MEMS design tools.
  • Knowledge of microfabrication technologies, materials, process design rules, tolerances and their impact on sensor performance, yield and reliability.
  • Knowledge of MEMS packaging technologies and constraints, including die attach, bonding, interconnections, sealing, cavity or vacuum packages, thermo-mechanical stress, outgassing and reliability.
  • Ability to perform sensor-package co-design and to evaluate the interaction of the MEMS device with ASICs, electronics, assembly processes and the operating environment.
  • Familiarity with laboratory instrumentation, prototype characterization, environmental testing, statistical analysis and failure-analysis techniques.
  • Ability to work autonomously and within multidisciplinary teams, with a structured approach to problem solving and requirements management.
  • Ability to deliver results within schedule, quality and cost constraints.
  • Good written and spoken English; knowledge of additional languages is a plus.

Annual gross salary from 33.058,74€ and applicable NCBA is Metalmeccanico (Contratto Collettivo Nazionale di Lavoro per i dipendenti delle industrie metalmeccaniche private e della installazione di impianti); The salary we're displaying represents only the minimum wage according to CLA applied. Final salary offer will depend on your experience and qualifications and are also based on objective and gender-neutral criteria. Incentives and benefits to be part of the offer.

We are an equal opportunity employer and value diversity at our company. We do not discriminate based on race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment. Please contact us to request accommodation.

Skills Required

  • Master's degree in Electronics, Microelectronics, Physics, Materials Science, or a related discipline
  • Relevant experience in MEMS development
  • Knowledge of MEMS sensing principles, micromechanics, transduction mechanisms, and MEMS sensor performance and error sources
  • Experience designing, modeling, and simulating control loops for MEMS structures using finite-element, multiphysics, and dedicated MEMS design tools
  • Knowledge of microfabrication technologies, materials, process design rules, tolerances, yield, and reliability
  • Knowledge of MEMS packaging technologies, including die attach, bonding, interconnections, sealing, cavity or vacuum packages, thermo-mechanical stress, outgassing, and reliability
  • Ability to perform sensor-package co-design and evaluate interactions with ASICs, electronics, assembly processes, and operating environments
  • Familiarity with laboratory instrumentation, prototype characterization, environmental testing, statistical analysis, and failure-analysis techniques
  • Ability to work autonomously and within multidisciplinary teams using structured problem solving and requirements management
  • Ability to deliver results within schedule, quality, and cost constraints
  • Good written and spoken English
  • Knowledge of additional languages

The Aerospace Corporation Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about The Aerospace Corporation and has not been reviewed or approved by The Aerospace Corporation.

  • Retirement Support — The 401(k) plan provides a company‑paid contribution of 8–12% based on years of service with immediate eligibility and vesting, and eligible employees can access retiree medical benefits.
  • Leave & Time Off Breadth — Paid time off includes 15 vacation days (rising to 20 after five years), nine paid holidays, and unlimited sick time for exempt employees with accruals for non‑exempt staff.
  • Flexible Benefits — Flexible work models include a 9/80 schedule with alternating Fridays off, supported by backup care services, an EAP, relocation assistance, and home‑office stipends where applicable.

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The Company
HQ: Chantilly, VA
4,600 Employees
Year Founded: 1960

What We Do

The space enterprise has been transformed by rapid change and growth. New vehicles for national security space, a more rapid launch cadence, proliferated satellite constellations, the pursuit of interplanetary exploration, and thriving commercial ventures are changing the nature of the space industry. The Aerospace Corporation (Aerospace) is a leading architect for U.S. space programs, shaping efforts to outpace threats to our national security while cultivating the technologies needed to further this new era of space commercialization and exploration. Aerospace works across the space enterprise in service of the public interest. In addition to supporting the Department of Defense and the Intelligence Community, our customers include NASA, NOAA, numerous federal agencies, and commercial space — all of whom benefit from our deep technical knowledge. We only pursue business related to the space mission and complementary fields, operating as the nation’s trusted partner to solve the toughest challenges and develop reliable and innovative technologies. Innovation in space occurs when people have the freedom to imagine and do. At Aerospace, we take pride in our readiness to solve some of the most complex challenges in the space enterprise.

Why Work With Us

We are a non-profit corporation chartered by the government to work on the hardest problems in space. We employ technical experts in every discipline of space-related science and engineering who touch every part of the US space program. Come join us as we make an impact bigger than ourselves.

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