SkyWater is hiring a Mechanical Stress Simulation Staff Engineer to be responsible for executing advanced mechanical stress simulations for semiconductor advanced packaging, heterogeneous integration, and BEOL (Back-End-Of-Line) metallization layers. This role leverages industry-leading software tools to model, analyze, and optimize mechanical and thermal behaviors in complex semiconductor structures, ensuring reliability and performance across device, die, chip, and package levels.
Key Responsibilities:
- Develop and execute multi-level mechanical stress models for semiconductor devices, circuits, dies, chips, and packaging.
- Simulate elastic, viscoelastic, and crack-related phenomena, including recoverable stress/strain, plastic deformation, delamination, and crack propagation, with direct impact on device performance and BEOL reliability.
- Utilize advanced simulation software such as ANSYS, TCAD Sentaurus, SInterconnect, and MultiPhysics Fusion to analyze mechanical stress, heat transfer, and dissipation in semiconductor packaging and BEOL layers.
- Plan test structures to characterize material properties (bulk modulus, shear modulus, coefficient of thermal expansion, binding strength) required for simulation and reproducing shortloop experiments.
- Collaborate with process integration teams to utilize simulation results in design and manufacturing workflows.
- Document methodologies, results, and recommendations for reliability improvements and yield enhancement.
Required Skills & Qualifications:
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field with 3+ years of related experience.
- Experience with crack/delamination analysis and BEOL processes/materials.
- Proficiency in finite element analysis (FEA) and simulation methodologies.
- Hands-on expertise with mechanical simulation tools (ANSYS, Sentaurus, MultiPhysics Fusion, AutoCAD, SolidWorks).
- Familiarity with semiconductor packaging systems and BEOL materials.
- Strong analytical, problem-solving, and communication skills.
Preferred Experience:
- Prior work in semiconductor industry, especially in packaging and BEOL.
- Knowledge of device performance impacts due to mechanical stress.
- Experience with characterization of material properties and shortloop experimental validation.
- Semiconductor technology integration experience
#SW2
The annual salary range for this role is $95,200 - $142,800. Pay offered is based on many factors, including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well as other employee financial benefits, including 401k match, and life insurance.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or [email protected].
EOE, including disability/vets
Skills Required
- Bachelor's or Master's degree in Mechanical Engineering, Materials Science, or a related field
- 3+ years of related experience
- Experience with crack and delamination analysis
- Experience with BEOL processes and materials
- Proficiency in finite element analysis and simulation methodologies
- Hands-on expertise with ANSYS, Sentaurus, MultiPhysics Fusion, AutoCAD, and SolidWorks
- Familiarity with semiconductor packaging systems and BEOL materials
- Strong analytical, problem-solving, and communication skills
- Prior semiconductor industry experience, especially in packaging and BEOL
- Knowledge of device performance impacts caused by mechanical stress
- Experience characterizing material properties and validating simulations through shortloop experiments
- Semiconductor technology integration experience
What We Do
SkyWater is the only U.S.-owned and U.S.-based pure play semiconductor foundry and is a DOD-accredited Trusted supplier, specializing in custom technology development services and volume manufacturing for integrated circuits and micro devices. Through its Technology Foundry model, SkyWater’s world-class operations and unique processing capabilities enable mixed-signal CMOS, power, rad-hard and ROIC solutions. SkyWater’s Advanced Technology Services empower development of superconducting and 3D ICs, along with carbon nanotube, photonic and MEMS devices. The company serves customers in growing markets such as aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial, and IoT. For more information, please visit: www.skywatertechnology.com/.
