WETS Deposition group at Lam India Global Hardware Technology (LIGHT) is hiring a Mechanical Lead Engineer for its product development engineering and product ownership team.
Job Summary
As a Mechanical Lead Engineer, you will own the design and delivery of advanced mechanical and electro-mechanical subsystems for wafer fabrication equipment, with primary focus on fluid delivery systems and Process modules for WETS Deposition products. The role spans feasibility studies, concept and detailed design, prototyping, engineering analysis, test planning, validation, and documentation through release. You will provide technical leadership across system architecture, packaging, and cross-functional integration to deliver robust, manufacturable, and serviceable solutions.
Job Responsibilities
- Design, develop, and release mechanical sub-systems by owning medium to high‑complexity projects, working with India teams and the Product Group in Villach across NPD, CIP, NSR, and Cost Reduction initiatives.
- Ensure on-time, high-quality delivery against defined KPIs by following the Product Development and Release (PDR) process and securing stakeholder approvals.
- Provide technical guidance and mentorship to junior engineers and New College Graduates.
- Execute concurrent engineering for fluid systems and fabricated/machined assemblies, applying DFx principles to optimize performance, cost, and manufacturability.
- Apply expertise in sheet metal design, material selection, and manufacturing processes, with strong DFM/DFA practices.
- Perform OEM mechanical component selection aligned with functional, quality, cost, and supplier requirements.
- Support structural and thermal validation through FEA and first‑principles calculations.
- Work within established engineering processes and collaborate with cross‑functional teams and vendors to deliver safe, reliable, and cost‑effective designs.
Minimum Qualifications
- Education: B.E. / B.Tech / M.E. / M.Tech in Mechanical Engineering
- Experience: 6+ years of relevant experience in mechanical product development; semiconductor equipment experience preferred.
- Strong competency in concept design and development of complex components and medium‑complex sub‑systems, executing the full PDR lifecycle from requirements definition through validation, release, and documentation.
- Demonstrated structured problem‑solving and decision‑making capability using standard engineering tools such as 8D, Fishbone, 5 Whys, Pareto analysis, and Pugh matrix.
- Proven ability to drive and deliver projects through effective cross‑functional collaboration with Manufacturing, Supply Chain, Electrical/Controls, and Product Safety teams.
- Deep understanding of DFM, DFA, DFS, cost optimization, and engineering change management, enabling robust, manufacturable, and serviceable designs.
- Hands‑on experience in fluidics and pneumatics system design, including informed OEM component selection for valves, regulators, sensors, fittings, and related hardware.
- Working knowledge of plastic materials and manufacturing processes, including machining, joining, traditional molding, and additive manufacturing techniques.
- Experience in the Semiconductor Wafer Fab Equipment (WFE) domain, with exposure to equipment design, development, or sustainment environments.
- Strong written and verbal communication skills, with the ability to clearly articulate technical concepts and deliver effective technical presentations.
- High proficiency in 3D CAD tools such as Creo, Siemens NX, ProE, SolidWorks, or equivalent mechanical design platforms.
- Hands‑on experimental and design background, complemented by strong fundamental engineering skills and practical problem‑solving capability.
Skills Required
- B.E., B.Tech, M.E., or M.Tech degree in Mechanical Engineering
- 6+ years of relevant experience in mechanical product development
- Experience designing complex components and medium-complexity subsystems through requirements, validation, release, and documentation
- Experience with DFM, DFA, DFS, cost optimization, and engineering change management
- Hands-on fluidics and pneumatics system design experience, including OEM component selection
- Knowledge of plastic materials and manufacturing processes, including machining, joining, molding, and additive manufacturing
- Experience with sheet metal design, material selection, and manufacturing processes
- Experience with 3D CAD tools such as Creo, Siemens NX, ProE, SolidWorks, or equivalent
- Semiconductor wafer fabrication equipment experience
- Experience with structural and thermal validation using FEA and first-principles calculations
- Strong written and verbal communication and technical presentation skills
Lam Research Corporation Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Lam Research Corporation and has not been reviewed or approved by Lam Research Corporation.
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Parental & Family Support — Parental leave is described as 16 weeks fully paid for all new parents, with birth mothers averaging about 26 weeks total; adoption assistance and subsidized backup childcare are also included. These programs are consistently highlighted as standout elements of the package.
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Healthcare Strength — Medical options span PPO, CDHP, and HMO choices with company HSA funding, alongside dental and vision coverage. Coverage quality and breadth are emphasized, supported by wellbeing resources such as an EAP.
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Equity Value & Accessibility — An ESPP with a discount and look-back/reset features is highlighted, and many technical roles include RSUs and bonuses that lift total compensation. These equity mechanisms are frequently cited as meaningful components of total rewards.
Lam Research Corporation Insights
What We Do
Lam Research Corp. (NASDAQ:LRCX) is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. The world's leading companies trust us as their valued partner because we bring together technology leadership, a strong values-based culture, and an unwavering commitment to prove our customers’ next big breakthrough. Our impact on the world can be seen all around us, as nearly every advanced chip today is built with our technology. Through collaboration, precision, and our commitment to delivery, we are transforming atomic-scale engineering and driving semiconductor breakthroughs that define the next generation. Lam Research Social Media Guidelines: By using or accessing this page, you agree to comply with LinkedIn’s Terms and Conditions. While we welcome participation and engagement, it is important to note that postings and/or comments by followers to Lam’s LinkedIn page do not necessarily reflect the opinions of Lam, nor does Lam confirm their accuracy. We expect that participants post content and commentary that is both relevant and respectful to this community as a whole. Lam reserves the right to remove any posts and/or comments that do not adhere to our guidelines and to block anyone who violates them repeatedly. Specifically, we do not tolerate these kinds of posts: • Abusive, harassing, stalking, threatening or attacking others • Defamatory, offensive, obscene, vulgar or depicting violence • Hateful in language targeting race/ethnicity, religion, gender, nationality or political beliefs • Fraudulent, deceptive, misleading or unlawful • Violations of any intellectual property rights • Spamming in nature • Commercial solicitation or solicitation of donations • Link baiting (embedding a link in your post to draw traffic to your own site) View Lam’s Online Privacy Notice Summary : https://www.lamresearch.com/privacy/






