Mechanical Engineer 3

Posted 2 Days Ago
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Tualatin, OR, USA
In-Office
Senior level
Semiconductor • Manufacturing
The Role
Designs mechanical components, assemblies, and subsystems for semiconductor wet-processing equipment. Translates system requirements into CAD models, drawings, and engineering documentation; performs tolerance, thermal, and structural analyses; supports NPI prototypes, integration, validation, design reviews, DFMEA, manufacturing, supplier collaboration, sustaining engineering, and field issue resolution. Mentors junior engineers and helps deliver manufacturable, reliable, cost-effective products.
Summary Generated by Built In
The group you’ll be a part of
You’ll be joining the WETS Product Group, a highly collaborative, cross‑disciplinary organization within Lam’s Global Products Group (GPG), focused on delivering industry‑leading wet processing solutions for advanced semiconductor manufacturing. The WETS organization develops liquid‑based process equipment supporting both wafer and panel‑level applications, with a strong emphasis on new product introduction (NPI), technology differentiation, and manufacturing scalability. Our teams work closely across mechanical, electrical, controls, software, systems, and process engineering, partnering globally to bring complex, high‑performance tools from concept through production while meeting aggressive cost, schedule, and quality targets.

 

The impact you’ll make
As a Mechanical Engineer III in the WETS Product Group, you will contribute directly to the design, development, and delivery of next‑generation wet processing equipment for advanced semiconductor manufacturing. Your work will support critical New Product Introduction (NPI) programs, shaping mechanical designs that meet performance, reliability, cost, and manufacturability goals. In this role, you will translate system‑level and subsystem requirements into robust mechanical solutions, working closely with Systems, Process, Electrical, Controls, and Manufacturing Engineering partners. Your contributions will help reduce development risk, accelerate schedules, and enable high‑quality products to reach customers on time. This is an execution‑focused role with meaningful ownership, where strong fundamentals and good engineering judgment make a visible impact on product success.
What you’ll do
  • Design and develop mechanical components, assemblies, and subsystems for complex semiconductor manufacturing equipment.
  • Translate system‑ and subsystem‑level requirements into detailed mechanical designs, layouts, and drawings.
  • Create and maintain 3D CAD models, detailed drawings, and engineering documentation in accordance with Lam standards.
  • Perform engineering analysis (e.g., tolerance analysis, thermal‑mechanical considerations, structural integrity) to support design decisions.
  • Collaborate with cross‑functional teams including Systems, Process, Electrical, Controls, Software, and Manufacturing Engineering to ensure successful subsystem integration.
  • Support prototype build, system integration, debug, and validation activities related to New Product Introduction (NPI) projects.
  • Support New Product Introduction (NPI) phase‑gate activities (Preliminary Design Review (Pre‑DR), Detailed Design Review (DDR), Critical Design Review (CDR), and Final Design Review (FDR)) by delivering assigned mechanical design milestones on schedule.
  • Participate in design reviews, risk assessments, and failure analysis, contributing to Design Failure Mode and Effects Analysis (DFMEA) and corrective action efforts.
  • Work with Manufacturing Engineering and Supply Chain partners to ensure designs are manufacturable, serviceable, and cost‑effective.
  • Contribute to sustaining engineering efforts and field issue resolution as needed.
  • Mentor junior engineers in the performance of their assigned tasks.
Who we’re looking for
  • Bachelor’s degree in Mechanical Engineering or a related discipline with a minimum of 5 years of relevant engineering experience; or 3+ years with a Master’s degree; or equivalent practical experience.
  • Solid foundation in mechanical design principles, materials, and manufacturing processes.
  • Experience creating detailed mechanical designs using 3D CAD tools (e.g., Creo, NX).
  • Ability to read and interpret system requirements, drawings, and interface documentation.
  • Strong problem‑solving skills and attention to detail.
  • Effective written and verbal communication skills.
  • Ability to work productively in a collaborative, fast‑paced, New Product Introduction (NPI) environment.
Preferred qualifications
  • Experience with semiconductor manufacturing equipment or other complex electro‑mechanical systems.
  • Familiarity with wet processing, fluid handling/fluidic system design, thermal management, and chemical‑compatible mechanical design.
  • Exposure to New Product Introduction (NPI) development processes, phase‑gate reviews, or prototype builds.
  • Experience supporting production ramp or working with global suppliers.
  • Knowledge of Design for Excellence (DFx) principles (reliability, manufacturability, serviceability, safety).
  • Interest in technical growth toward senior engineering roles.
Our commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

 

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

 

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

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Our Perks and Benefits

At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits. 

Skills Required

  • Bachelor's degree in Mechanical Engineering or a related discipline with at least 5 years of relevant engineering experience
  • Alternatively, a Master's degree with at least 3 years of relevant engineering experience
  • Equivalent practical experience may substitute for the stated education and experience
  • Strong foundation in mechanical design principles, materials, and manufacturing processes
  • Experience creating detailed mechanical designs using 3D CAD tools such as Creo or NX
  • Ability to interpret system requirements, drawings, and interface documentation
  • Strong problem-solving skills and attention to detail
  • Effective written and verbal communication skills
  • Ability to work collaboratively in a fast-paced NPI environment
  • Experience with semiconductor manufacturing equipment or complex electromechanical systems
  • Familiarity with wet processing, fluid handling, fluidic system design, thermal management, and chemical-compatible mechanical design
  • Exposure to NPI development processes, phase-gate reviews, or prototype builds
  • Experience supporting production ramp or working with global suppliers
  • Knowledge of Design for Excellence principles, including reliability, manufacturability, serviceability, and safety

Lam Research Corporation Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Lam Research Corporation and has not been reviewed or approved by Lam Research Corporation.

  • Parental & Family Support — Parental leave is described as 16 weeks fully paid for all new parents, with birth mothers averaging about 26 weeks total; adoption assistance and subsidized backup childcare are also included. These programs are consistently highlighted as standout elements of the package.
  • Healthcare Strength — Medical options span PPO, CDHP, and HMO choices with company HSA funding, alongside dental and vision coverage. Coverage quality and breadth are emphasized, supported by wellbeing resources such as an EAP.
  • Equity Value & Accessibility — An ESPP with a discount and look-back/reset features is highlighted, and many technical roles include RSUs and bonuses that lift total compensation. These equity mechanisms are frequently cited as meaningful components of total rewards.

Lam Research Corporation Insights

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The Company
HQ: Fremont, CA
12,447 Employees
Year Founded: 1980

What We Do

Lam Research Corp. (NASDAQ:LRCX) is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. The world's leading companies trust us as their valued partner because we bring together technology leadership, a strong values-based culture, and an unwavering commitment to prove our customers’ next big breakthrough. Our impact on the world can be seen all around us, as nearly every advanced chip today is built with our technology. Through collaboration, precision, and our commitment to delivery, we are transforming atomic-scale engineering and driving semiconductor breakthroughs that define the next generation. Lam Research Social Media Guidelines: By using or accessing this page, you agree to comply with LinkedIn’s Terms and Conditions. While we welcome participation and engagement, it is important to note that postings and/or comments by followers to Lam’s LinkedIn page do not necessarily reflect the opinions of Lam, nor does Lam confirm their accuracy. We expect that participants post content and commentary that is both relevant and respectful to this community as a whole. Lam reserves the right to remove any posts and/or comments that do not adhere to our guidelines and to block anyone who violates them repeatedly. Specifically, we do not tolerate these kinds of posts: • Abusive, harassing, stalking, threatening or attacking others • Defamatory, offensive, obscene, vulgar or depicting violence • Hateful in language targeting race/ethnicity, religion, gender, nationality or political beliefs • Fraudulent, deceptive, misleading or unlawful • Violations of any intellectual property rights • Spamming in nature • Commercial solicitation or solicitation of donations • Link baiting (embedding a link in your post to draw traffic to your own site) View Lam’s Online Privacy Notice Summary : https://www.lamresearch.com/privacy/

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