Microamp Solutions is seeking qualified, energetic individuals (Junior / Mid / Senior) to specify, design, and develop mechanical systems and solutions for cutting-edge 5G mmWave Radio Units. As a Mechanical Design Engineer, you will focus on mechanical system design, prototyping, deployment, and validation.
Key ResponsabilitiesFull product lifecycle management: from initial system concept, through detailed mechanical design, simulation, and prototyping, to testing, verification, integration, and production support.
Ensuring robust and cost-effective designs that meet performance, manufacturability, and regulatory standards.
Collaborating with cross-functional teams to optimize enclosure performance.
Preparing high-quality technical documentation (3D models, 2D drawings, BOMs, and manufacturing data packs).
Performing tolerance analysis, material selection, and design for manufacturing (DFM) and assembly (DFA).
Supporting production and troubleshooting mechanical issues during system integration and testing.
BSc, MSc or PhD, equivalent in technical or scientific discipline (Mechanical Engineering, Mechatronics preferred) or equivalent work experience,
Proficiency in 3D CAD software (e.g., SolidWorks, CATIA, Creo, or Siemens NX) for modeling and simulation.
Understanding of RF shielding principles, including EMI/EMC requirements, gasket design, and conductive coatings.
Experience with thermal management solutions for RF enclosures, such as heat sinks, thermal interfaces, and airflow design.
Knowledge of materials suitable for RF enclosures (e.g., aluminum, copper, stainless steel, and specialized coatings).
Knowledge of manufacturing processes, including CNC machining,die casting, extrusion, machining, and surface treatments for enclosures.
Your confidence, trustworthiness, and general excitement of technology is a must!
Understanding of materials selection and their properties (e.g., metals, plastics, composites).
Familiarity with mechanical design standards and best practices.
Familiarity with structural design and vibration analysis for enclosures.
Experience in finite element analysis (FEA) for structural, thermal, and dynamic simulations.
Knowledge of thermal management solutions for electronic systems (e.g., heat sinks, thermal interfaces, and airflow design).
Experience in designing for regulatory compliance (e.g., CE, FCC, or other industry standards).
Job benefits
7000 - 17000 PLN gross (depending on experience level and contract type),
Exposure to the full product lifecycle, from design to prototyping and testing.
Opportunity to join a fast-growing team at the early stage,
Healthcare & Sport packages,
Flexible working hours (inc. homeworking),
Integration events,
Great atmosphere and coffee 😊.
Skills Required
- BSc, MSc, or PhD in Mechanical Engineering, Mechatronics, or an equivalent technical or scientific discipline, or equivalent work experience
- Proficiency with 3D CAD software such as SolidWorks, CATIA, Creo, or Siemens NX
- Understanding of RF shielding, EMI/EMC requirements, gasket design, and conductive coatings
- Experience with thermal management for RF enclosures, including heat sinks, thermal interfaces, and airflow design
- Knowledge of materials suitable for RF enclosures, including aluminum, copper, stainless steel, and specialized coatings
- Knowledge of manufacturing processes including CNC machining, die casting, extrusion, machining, and surface treatments
- Understanding of materials selection and material properties, including metals, plastics, and composites
- Familiarity with mechanical design standards and best practices
- Familiarity with structural design and vibration analysis for enclosures
- Experience with finite element analysis for structural, thermal, and dynamic simulations
- Knowledge of thermal management solutions for electronic systems
- Experience designing for regulatory compliance, including CE and FCC standards
What We Do
Microamp Solutions is a telecommunications technology company specializing in resilient 5G mmWave connectivity for real-time operations. It designs, builds, and delivers ultra-high-capacity, near-zero-latency end-to-end networks using purpose-built radios, gNodeBs, customer-premises equipment, and related infrastructure. Its solutions support critical infrastructure, ports, logistics hubs, public transportation, media production, mass events, industrial operations, and specialized military missions.
