If you are looking to excel and make a difference, take a closer look at us…
Overview:
The Manager, Electrical & Electronics (E&E) / Semiconductor Specialist within the Business & Corporate Banking (BCB) Division specifically for Process Engineers, Equipment Engineers, and Supplier Qualification / Quality Engineers to transition their technical mastery into corporate banking.
Prior banking experience is not required. In this role, you will evaluate technology projects, assess equipment and operational risks, and guide banking teams on sector-specific financing decisions.
Key Responsibilities
- Conduct Technical Due Diligence: Travel to semiconductor fabs, OSAT plants, data centers, and equipment assembly sites to inspect machinery and infrastructure, verify setup progress, and validate project feasibility.
- Support Deal Structuring: Translate equipment capital expenditure, setup schedules, power/cooling infrastructure requirements, and yield targets into practical credit and financing solutions
- Assess Sector Risks: Evaluate operational reliability, tool depreciation, technology obsolescence, and supply chain stability for technology vendors and equipment suppliers.
- Advise Banking Teams: Serve as an internal technical expert connecting tech clients, Relationship Managers, and credit committees to ensure accurate risk assessments.
- Track Trade Dynamics: Provide insights on global trade policies, export restrictions, tariffs, and supply chain disruptions affecting the sector.
- Identify Business Leads: Utilize industry networks and sector insights to spot prospective corporate clients and refer business opportunities to Relationship Managers
What We Are Looking For:
- Bachelor’s degree in Electrical & Electronics Engineering, Computer Engineering, or a related technical field.
- 8 years and above of experience in the semiconductor ecosystem (e.g., fabs, OSAT plants, automated test equipment OEMs) or the data center ecosystem (e.g., AI/HPC hardware clusters, server infrastructure, precision power and cooling systems).
- Clear understanding of front-end/back-end manufacturing processes or data center physical/power infrastructure, machine lead times, precision tooling, and emerging trends (such as AI hardware acceleration, 2.5D/3D ICs, and chiplets).
- Demonstrated capability to evaluate high-value hardware installations, tool depreciation cycles, facility commissioning, and operational supply chain risks.
- Practical understanding of global supply chain dynamics, trade regulations, export controls, and policy impacts on technology hardware.
- Ability to distill complex technical details into clear, concise risk and business insights for internal stakeholders (including banking and risk teams) and external clients.
- Candidate must be willing to travel as required. We are also open to candidates willing to relocate to Kuala Lumpur.
About Hong Leong Bank
We are a leading financial institution in Malaysia backed by a century of entrepreneurial heritage. Providing comprehensive financial services guided by a Digital-at-the-Core ethos has earned us industry recognition and accolades for our innovative approach in making banking simpler and more effortless for our customers. Our digital and physical offerings span across a vast nationwide network in Malaysia, strengthened with an expanding regional presence in Singapore, Hong Kong, Vietnam, Cambodia, and China.
We seek to strike a balance between diversity, inclusion and merit to achieve our mission of infusing diversity in thinking and skillsets into our organisation. Candidates are assessed based on merit and potential, in line with our mission to attract and recruit the best talent available. Expanding on our “Digital at the Core” ethos, we are progressively digitising the employee journey and experience to provide a strong foundation for our people to drive life-long learning, achieve their career aspirations and grow talent from within our organisation.
Realise your full potential at Hong Leong Bank by applying now.
Skills Required
- Bachelor's degree in Electrical and Electronics Engineering, Computer Engineering, or a related technical field
- At least 8 years of experience in the semiconductor or data center ecosystem
- Understanding of semiconductor front-end and back-end manufacturing processes or data center physical and power infrastructure
- Knowledge of machine lead times, precision tooling, AI hardware acceleration, 2.5D and 3D ICs, and chiplets
- Experience evaluating high-value hardware installations, tool depreciation cycles, facility commissioning, and operational supply chain risks
- Understanding of global supply chain dynamics, trade regulations, export controls, and policy impacts on technology hardware
- Ability to communicate complex technical details as clear risk and business insights for banking, risk, and external stakeholders
What We Do
Hong Leong Bank Berhad is one of the leading financial services organisations in Malaysia. With a heritage of more than 100 years, it provides comprehensive financial services covering consumer banking, business banking and trade finance, treasury, branch and transaction banking, wealth management, private banking and Islamic financial services. Its merger with EON Bank Group in 2011 has further embedded its position as a core banking franchise with an expanded distribution network of more than 300 branches across the country. With a proven track record in value creation and a highly recognised brand, Hong Leong Bank has also been extending its footprint in the region, with branches in Singapore and Hong Kong and wholly owned subsidiaries in Vietnam and Cambodia. In China, the Bank has a 20% shareholding in Bank of Chengdu Co., Ltd., Sichuan and a consumer finance joint venture. Hong Leong Bank is a subsidiary of Hong Leong Financial Group Berhad, the financial services arm of the Hong Leong Group. Apart from banking, Hong Leong Financial Group is involved in the provision of insurance and takaful, as well as investment banking, unit trust, fund management and stock broking services
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