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Cadence Design Systems Inc. is looking for a motivated Lead Application Engineer: IC Packaging Design & Analysis to work with us in Munich, Germany or optional any other Cadence site in Europe.
At Cadence, we hire and develop leaders and innovators who want to impact the world of technology. Cadence has been nominated as a Great Place to Work globally and in Germany and other European countries and is also a Fortune 100 Best Companies to Work For.
As an Application Engineer, you will be part of the Customer Success Team (CST) organisation and specifically in the System Design and Analysis (SDA) team in Munich, Germany or another Cadence site in Europe. In this role in the SDA team you’ll work with Allegro X Advanced Package Designer (APD) and system level analysis tools from the Sigrity platform. You’ll work with customers designing leading edge advanced packages using Cadence tools and flows for Chip – Package – PCB co-design.
To understand more on our tools & flows, you can visit Allegro X Advanced Package and Sigrity-X Platform
Job Responsibilities
- Support customers in the deployment and adoption of Cadence IC Packaging design and analysis solutions; Assist customers in debugging and optimizing designs involving System Design, Board, Package, Heterogenous integrated 2.5/3D-IC designs, High-Speed Interfaces technologies, using either tool capabilities, scripting techniques or new methodologies.
- Drive methodology and solution-oriented discussions with key stakeholders. Educate and drive adoption of new technology across customers.
- Train and ramp-up new customers designing IC Packages with Cadence IC Packaging tools and solutions.
- Collaborate with R&D, field teams, and product specialists to reproduce issues, test solutions, and improve tool usability.
- Develop technical documentation, examples, and knowledge content to improve customer self-service and tool adoption. Document findings, methodologies, and best practices to improve customer self-service and internal knowledge sharing.
- Build relation with worldwide teams to collaborate on needs. Mentor junior engineers and contribute to the development of technical expertise within the team.
Requirements:
- Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or related fields.
- Experience in IC Package design using APD and knowledge in available package technologies. Experience in Signal Integrity and Power Integrity (SI/PI) on IC Package and PCB level would be beneficial.
- Strong analytical, debugging, and problem-solving skills.
- Strong english written, verbal and presentation skills.
- Drive to continuously learn about IC Package technologies and analysis to support customers on leading edge design challenges
- Ability to establish a close working relationship with both customer and internal stakeholders. Mentorship expertise is nice to have.
- A valid work- and residence permit
About Cadence Design Systems:
Cadence is the only company that provides the expertise and tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live, work, and play. Our products are used in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. For more information, access http://www.cadence.com.
Be proud and passionate about the work you do. Together, our One Cadence -- One Team culture drives our success.
We’re doing work that matters. Help us solve what others can’t.Skills Required
- Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field
- Experience in IC package design using Allegro X Advanced Package Designer and knowledge of package technologies
- Experience with signal integrity and power integrity on IC package and PCB levels
- Strong analytical, debugging, and problem-solving skills
- Strong written, verbal, and presentation skills in English
- Ability and motivation to continuously learn about IC package technologies and analysis
- Ability to establish close working relationships with customers and internal stakeholders
- Mentorship expertise
- Valid work and residence permit
Cadence Design Systems Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cadence Design Systems and has not been reviewed or approved by Cadence Design Systems.
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Equity Value & Accessibility — A discounted ESPP with a lookback feature and equity included in total compensation make ownership broadly accessible and potentially meaningful. Structured compensation at an industry leader adds predictability to equity participation.
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Healthcare Strength — Medical, dental, and vision coverage are described as solid, with mental‑health/EAP and fertility support enhancing the offering. The breadth across core care and family‑building needs strengthens the healthcare package.
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Leave & Time Off Breadth — Global Recharge Days, volunteer time off, and companywide breaks indicate a comprehensive time‑off framework. In addition, many salaried roles are described as having flexible or generous PTO policies.
Cadence Design Systems Insights
What We Do
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and IP are used by customers to deliver products to market faster. The company's Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.
