Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.
At Qnity, we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.
- Strategic technology planning & Leadership
- Define test vehicle strategy aligned with advanced packaging and interconnect technology roadmaps.
- Collaborate with cross-functional teams (design, process integration, quality, yield rate management, reliability, and manufacturing) to ensure TVs meet technology development objectives.
- Optimize cost management & allocation with raw materials & its supply, process design, layout design, yield rate improvement, and time to meet schedule.
- Devise Tear down strategy to meet business/product line requirements and delivery bench market report to support product line technology development.
- Next Gen Technology involvement with vertical value supply chain from PCB MLB, mSAP/HDI, IC Substrate & advanced packaging
- Technical Development
- Leder test vehicle engineers to delivery TVs for product line development.
- Lead design and layout of complex test vehicles for heterogeneous integration, advanced substrates, and interconnect structures.
- Lead design and integration of process flow, recipe, chemistry selection, process equipment selection.
- Continuously Improve TV manufacturing yield rate.
- Leverage external vendor and resource to deliver technology roadmap.
- Oversee electrical, mechanical, and thermal performance validation through TVs.
- Project Management
- Manage TV development timelines, budgets, and deliverables.
- Coordinate with external suppliers and internal stakeholders for material procurement and fabrication.
- Cost management and allocation for initiators.
- Tear down alignment to meet product line requirement.
- Innovation & Problem Solving
- Identify gaps in test methodologies and propose innovative solutions.
- Drive continuous improvement in TV design to accelerate technology qualification.
- Upgrade and recommendation of next on pilot line requirement.
- Leverage equipment and raw material vendors to support TVs.
- Leverage & establish outsourcing partner to enable full process capability.
- Documentation & Reporting
- Prepare technical reports, presentations, and documentation for internal and external stakeholders.
- Support IP generation and patent filings related to TV innovations.
- Qualifications
- Education: Master’s or Ph.D. in chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related field.
- Core Knowledge: (1) Strong understanding of advanced packaging technologies with vertical value supply chain from PCB MLB, mSAP/HDI, IC Substrate & advanced packaging (2) Familiarity with design-for-test principles and reliability qualification methodologies.
- Experience
- Required: 8+ years in advanced packaging or advanced PCB, HDI interconnect technology development.
- Proven track record in leading test vehicle design and execution for technology qualification.
- Preferred: (1) Experience with heterogeneous integration, advanced substrate design, and high-density interconnects. (2) Prior involvement in cross-functional technology development programs.
- Skills
- Technical Skills: R&D, Process experience in advanced interconnect technology.
- Leadership & Communication
- Strong project management and team leadership capabilities.
- Excellent communication skills for cross-functional collaboration and stakeholder engagement.
- Analytical & Problem-Solving
- Ability to analyze complex technical challenges and develop innovative solutions.
Strategic thinking, adaptability, and ability to work in a fast-paced env
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Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.
Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page.
We use Artificial Intelligence (AI) to enhance our recruitment process.
Skills Required
- Master's or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field
- Strong understanding of advanced packaging technologies across PCB MLB, mSAP/HDI, IC substrates, and advanced packaging
- Familiarity with design-for-test principles and reliability qualification methodologies
- 8+ years of experience in advanced packaging or advanced PCB and HDI interconnect technology development
- Proven track record leading test vehicle design and execution for technology qualification
- Experience with heterogeneous integration, advanced substrate design, and high-density interconnects
- Prior involvement in cross-functional technology development programs
- Advanced interconnect technology research and development and process experience
- Strong project management and team leadership capabilities
- Excellent communication skills for cross-functional collaboration and stakeholder engagement
- Ability to analyze complex technical challenges and develop innovative solutions
Qnity Electronics, Inc. Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Qnity Electronics, Inc. and has not been reviewed or approved by Qnity Electronics, Inc..
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Strong & Reliable Incentives — Performance-based bonus plans tied to individual and company results are a core part of the package. Feedback suggests these incentives are positioned as competitive and, in some roles, experienced as meaningful.
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Retirement Support — Retirement savings options are portrayed as strong, including a 401(k) with employer contributions. Some disclosures indicate automatic company contributions, reinforcing long-term financial support.
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Healthcare Strength — Medical, dental, vision, life, and disability coverage are presented as comprehensive with additional wellbeing programs and day-one eligibility signals. This breadth is framed to support physical and financial wellbeing.
Qnity Electronics, Inc. Insights
What We Do
Qnity Electronics, Inc. is a premier technology provider across the semiconductor and advanced electronics value chain. It specializes in providing high-performance materials and integration expertise to enable breakthroughs in AI, high-performance computing, and advanced connectivity. Its offerings range from semiconductor chip manufacturing solutions to high-speed transmission materials for complex electronic systems, serving as a critical partner in the global electronics ecosystem.
