The successful candidate will design and validate high‑speed packages through EM simulation, signal/power integrity analysis, and correlation with lab test & measurement verification. In addition, you will develop and maintain ADKs across multiple EDA platforms, including rule decks, parameterized cells, technology files, and automated verification flows.
- Design, Modeling, and Verification
- Perform high‑speed package design for advanced heterogenous packages (e.g., SiP, FC‑BGA, 2.5D/3D, chiplets) for high-speed RF and Optoelectronics.
- Build and refine 3D EM models of package structures (transmission lines, interconnect and EM passives, etc.).
- Run and interpret EM, SI, and PI simulations (S‑parameters, TDR/TDT, eye diagrams, crosstalk, impedance, PDN impedance).
- Define and validate routing topologies and stackups to meet timing, loss, crosstalk, and impedance requirements.
- Collaborate with silicon, board, and system teams to co‑optimize package, die, and PCB for end‑to‑end performance.
- Correlate simulation results with lab measurements (VNA, TDR, high‑speed scopes) for model validation and sign‑off.
- ADK, EDA Flows, and Automation
- Develop and maintain Assembly Design Kits (ADKs) for package design across multiple EDA tools and foundry/OSAT technologies.
- Create and validate technology files, layer stacks, material properties, and design rule sets for package implementation.
- Develop DRC/LVS/validity rule decks for package layouts and ensure consistency across tools and process nodes.
- Build parameterized cells (PCells) and reusable library components for common package elements (vias, bumps, pads, RDLs, etc.).
- Implement scripted flows (e.g., Python, AEL, SKILL, etc.) to automate design entry, simulation setup, and verification.
- Integrate version control, configuration management, and documentation for ADKs and EDA flows.
You Have:
Ph.D. degree in Electrical Engineering or Physics with minimum of 4 years of industry experience (or MSEE with 8 years)
Expertise in 2.5D/3D EM component design, including interconnect, with simulation and analysis software (Cadence, Keysight ADS, 3DS CST or ANSYS HFSS, etc.)
Expertise in package design software (Cadence Allegro X APD, Siemens Xpedition, etc.)
Experience with developing PDKs/ADKs in EDA CAD tools (Cadence, Keysight, etc.)
Knowledge of IC packaging materials & techniques, substrate design, and microelectronics assembly process flows
Experience with SI/PI simulation and analysis software
Advanced knowledge of RF & Optoelectronics test & measurement equipment
Nice to Have:
Expertise in PCB technology, including schematic capture and layout design (Altium Designer, etc.)
Experience with RF component design (filters, couplers, equalizers, transitions)
Top Skills
What We Do
At Nokia, we create technology that helps the world act together. As a trusted partner for critical networks, we are committed to innovation and technology leadership across mobile, fixed and cloud networks. We create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs. Adhering to the highest standards of integrity and security, we help build the capabilities needed for a more productive, sustainable and inclusive world.
