High Speed Photodiode Design Engineer

Posted 4 Hours Ago
Be an Early Applicant
3 Locations
Remote or Hybrid
225K-305K Annually
Mid level
Hardware • Semiconductor
The Role
Designs, simulates, lays out, and characterizes high-speed integrated photodetectors, including PIN, APD, and waveguided structures. Responsibilities include optical and RF modeling, custom mask layout, foundry process optimization, and electro-optic testing of devices operating beyond 200 Gbps per lane. The role requires collaboration with process integration, validation, test, customer, and manufacturing teams to transition photonic components from concept through high-volume production.
Summary Generated by Built In
The Opportunity

OpenLight Photonics is looking for a highly motivated, experienced individual to drive the design, simulation, layout, and characterization of next-generation High-Speed Photodetectors. In this role, you will join a world-class team of engineers pioneering next generation photonic solutions spanning datacom, telecom, LiDAR, healthcare, high-performance computing, artificial intelligence, automotive and optical computing across next-generation communications and computing networks. 

You will be responsible for defining, designing and optimizing device physics, high-frequency RF behavior, and optical performance of Germanium-on-Silicon (Ge-on-Si) and heterogeneous III-V/Silicon integrated photodetectors. You will interface closely with multidisciplinary engineering teams, customers and wafer manufacturing foundries, to take components from initial concept to high-volume production.

What You Will Do
  • Design, simulate, and optimize active photonic components, focusing specifically on high-bandwidth PIN, Avalanche Photodiode (APD), and wave-guided photodetector structures. 

  • Utilize advanced optical simulation tools to model carrier transport dynamics, transit time limits, quantum efficiency, and dark current.

  • Model and design high-speed RF electrode configurations and matching transitions to ensure signal integrity at data rates reaching 200 Gbps per lane and beyond.

  • Own custom mask layouts (GDS/OASIS) within automated design environments, ensuring total adherence to foundry Design Rule Checking (DRC) and Layout Versus Schematic (LVS) rules.

  • Collaborate with the fab process integration team to optimize process corners, epitaxy parameters, and implant profiles for increased wafer yields.

  • Partner with validation and test engineering teams to perform hands-on electro-optic characterization, extracting high-speed s-parameters (S₂₁/S₁₁), responsivity, and reliability metrics.

Your Background Includes
  • Ph.D. or M.S. in Electrical Engineering, Physics, Photonics, Optics or a related field with a distinct emphasis on optoelectronic devices or high-speed semiconductor physics

  • 3+ years of experience (or equivalent academic research) in high-speed, integrated photodetector design, processing, or testing

  • Proficient with high-speed device simulations and circuit design tools (e.g. Ansys HFSS, CST, ADS, Sentaurus TCAD, Crosslight) 

  • Solid grounding in RF/microwave concepts, including transmission line theory, impedance matching, and parasitic RC parameter extraction

  • Direct experience with devices fabricated from Germanium (Ge) epitaxial growth or hybrid wafer-bonding techniques for III-V materials on silicon substrates.

  • Proficiency in Python or equivalent programming environments for automated layout generation (e.g., Luceda IPKISS, etc) 

  • Experience using statistical tools (e.g., JMP) and/or Python/SQL to parse automated wafer-level test data.

  • Familiarity with post-silicon testing protocols for optical transceivers, including bit error rate (BER) and optical eye diagram analysis.  

  • Experience with RF characterization of photonic devices (transceiver modules is a plus)

  • Strong analytical and problem-solving skills with the ability to work in a fast-paced, collaborative environment

  • Excellent written and verbal communication skills for technical documentation and reporting

About OpenLight

 OpenLight is growing as customer adoption and industry momentum continue to accelerate.  The rapid growth of AI and cloud infrastructure is driving unprecedented demand for faster, more energy-efficient optical connectivity. We are addressing this challenge through a platform approach that simplifies the development of photonic integrated circuits (PICs) and accelerates industry adoption. 

As part of our team, you will contribute to technologies that enable AI and hyperscale data centers, high-speed optical communications, advanced sensing applications, next-generation photonic integration, and more.   Our team is collaborative and fast-moving, and you will have the opportunity to make meaningful contributions across technology, operations, and business growth.

If you are excited about solving challenging problems, advancing cutting-edge technology, and working with a highly collaborative team, we would love to hear from you.

Skills Required

  • Ph.D. or M.S. in Electrical Engineering, Physics, Photonics, Optics, or a related field focused on optoelectronic devices or high-speed semiconductor physics
  • 3+ years of experience, or equivalent academic research, in high-speed integrated photodetector design, processing, or testing
  • Proficiency with high-speed device simulation and circuit design tools such as Ansys HFSS, CST, ADS, Sentaurus TCAD, or Crosslight
  • Knowledge of RF and microwave concepts, including transmission line theory, impedance matching, and parasitic RC extraction
  • Direct experience with Germanium epitaxial growth or hybrid wafer bonding for III-V materials on silicon substrates
  • Proficiency in Python or equivalent programming environments for automated layout generation, such as Luceda IPKISS
  • Experience using statistical tools such as JMP and/or Python or SQL to parse automated wafer-level test data
  • Familiarity with post-silicon optical transceiver testing, including bit error rate and optical eye diagram analysis
  • Experience with RF characterization of photonic devices
  • Experience with transceiver modules
  • Strong analytical and problem-solving skills
  • Excellent written and verbal communication skills for technical documentation and reporting
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The Company
44 Employees
Year Founded: 2022

What We Do

OpenLight develops and manufactures custom Photonic Application-Specific Integrated Circuit (PASIC) chips using a heterogeneous silicon-photonics platform that integrates active and passive optical elements, including lasers, modulators, amplifiers, and detectors, on a single chip. Its production-ready technology supports high-performance, energy-efficient connectivity and applications spanning datacom, telecom, LiDAR, healthcare, high-performance computing, artificial intelligence, and optical computing across next-generation communications and computing networks.

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