FY25 Graduate Failure Analysis Engineer

Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future. 

ADI At A Glance

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and Twitter (X)

The Team:

The Analog Devices International (ADI) Limerick Failure Analysis Team are part of the Global Quality Group responsible for providing analysis services & systems to support new product/technology development from the ADI Ireland site. We define the failure analysis flow, seeking detection of the failure mechanism which leads to solving the root cause of our customer’s issue. As part of Failure Analysis Centre of Excellence, we support and lead failure analysis and characterisation for several leading-edge development projects within ADI.

Job Role:

A vacancy is currently opened within the Quality Group for a Failure Analysis Engineer to support new product development, Fab Yield & Process transfer, and FA tools/techniques. The job will entail working closely with internal teams to support development process cycles of Integrated Circuits, using a wide variety of materials characterisation & failure analysis techniques.

Responsibilities include, but not limited to:

• To support/lead IC (Integrated circuit) failure analysis for ADI’s portfolio of products for release.
• To support emerging materials technology development for ADI’s (More Than Moore) portfolio of products.
• To liaise with design, product, reliability, and FAB engineers in order to efficiently and accurately analyse new development products and provide analysis/characterisation support.
• Develop new methodologies for the analysis and inspection of novel devices and materials.
• SPM- Scanning Probe Microscopy – Operation & technique development- AFM, SCM, MFM.
• Liaising with other FA materials engineers around the globe to support key projects.

• Routine use of electrical bench test setups, fault localisation systems, (Thermal, LEM, OBIRCH) sample preparation and inspection tools (X-ray, FIB, SEM, EDX, TEM, XPS, optical, mechanical polishing, broad ion beam polishing, wet chemical etching, plasma etching etc).
• Compiling reports for large interdisciplinary audiences (Quality & Design engineers, Sales & Marketing, FAB process engineers etc.).
• Consulting with internal customers in relation to a broad range of appropriate failure analysis & materials characterisation techniques (e.g. LEM, OBIRCH, SEM, FIB, TEM, XPS, AFM, etc.).
• Assist in maintenance of lab-based tools (Fault localisation systems, sample preparation & inspection tools) to ensure system uptime and efficiency. Leasing with vendors and support teams.
• Mentoring and consultation with other engineers in relation to IC & materials analysis and characterisation.
• Drive Continuous Improvement, Lean manufacturing & problem-solving activities.
• Showcase new FA analysis/characterisation developments at both internal level (ADI conferences and project meetings) in addition to external level (international conferences etc.).

Qualifications:

• BSC/BEng in Electronic Engineering, Physics, or related discipline with relevant industry experience an advantage.
•  Having a CO-OP or internship placement in a manufacturing company preferred but not essential
• Strong problem-solving skills with an aptitude for hands-on work; Semiconductor/ materials analysis and characterisation experience would be a distinct advantage.
• Broad knowledge of semiconductor/materials characterisation techniques including characterisation systems, features and functionality.
• Excellent organisation and communication skills (including interdisciplinary communication skills).
• Full training will be provided as required on hiring.

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For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Graduate Job

Required Travel: Yes, 10% of the time