At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Firmware Engineer Lead, based in Pune.
Required Experience:
- Experience developing embedded firmware for PCIe products.
- High level of proficiency in C (preferred) or C++, including development of C-based SDKs.
- High level of proficiency in Python for automating pre-processors/post-processors.
- Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.
- Hands-on experience with Server, Storage, and/or Networking equipment (e.g. Network Switches).
- Familiarity with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces
- Direct experience working on products with high-speed interfaces common in Data Center equipment: PCI- Express (Gen-3 and above), 100/400G Ethernet, Infiniband, NVMe, etc
Preferred Experience:
- Experience developing firmware to execute in on-chip microcontrollers as well as C-language SDKs to execute on system management controllers (e.g. BMC)
- Experience with industry forums and collaboration workgroups such as OCP and OpenBMC
- Experience with storage or SSD firmware, including NVMe, PCIe, CXL or flash management concepts.
- Hands-on experience with simulation or virtual platform–based development (e.g., VDK, QEMU, or similar)
Qualifications:
- Strong academic and technical background in electrical engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.
- Minimum 12+ years’ (Lead/Architect) experience supporting or developing complex SoC/silicon products for Server, Storage, and/or Networking applications
- Experience developing firmware to execute in on-chip microcontrollers as well as C-language software development kits (SDKs) to execute on system management controllers (e.g. BMC).
- Experience working with logic designers to architect and verify HW-SW interfaces on complex SoCs.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Skills Required
- Experience designing, coding and debugging real-time applications in C and/or C++
- Experience using or implementing Real-Time scheduler or RTOS
- Knowledge of 32-bit processor architecture
- Experience interfacing to hardware and peripherals (SPI, I2C, JTAG)
- Experience debugging at application and hardware level
- Appreciation of Software validation and verification techniques
- Ability to develop under different platforms (Linux, Windows)
- Experience with modern SW development workflows (CI/gitlab/makefile/CMake)
What We Do
Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry. Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective. Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF. These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems. Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.
