Director of Software Engineering UK, CH

Sorry, this job was removed at 12:21 p.m. (CST) on Friday, Jan 16, 2026
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Reading, Berkshire, England
In-Office
Artificial Intelligence • Semiconductor
The Role

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just the customers of today, but of tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.


We are actively seeking a resourceful Director of Software Engineering, based in either UK (Reading/Scotland) or Lausanne, Switzerland.


Key Responsibilities

  • Define, architect, develop, and deliver the full software stack including validation software, embedded firmware, device drivers, system software, SDKs, application-level software, and customer support/demonstration tools
  • Establish and continuously improve robust, scalable software development processes optimized for production environments. Ensure predictable delivery of high-quality, well-documented, secure, and maintainable software releases that meet stringent reliability and performance standards
  • Build, scale software capability aligned with company’s business strategy and product roadmap
  • Engage with customers (internal/external) to understand goals, strategies, and technical needs - and lead the definition and execution of high-value and quality solutions

Skills

  • Deep understanding of end-to-end software solution architecture with a proven track record of delivering complex, production-grade systems that integrate hardware and software across multiple technology domains
  • Expertise in software architectural principles emphasizing modularity, reusability, scalability, and maintainability. Strong command of modern software development methodologies including Agile/Scrum, continuous integration/continuous deployment (CI/CD), automated testing frameworks, and DevOps practices
  • Strong organizational and program management capabilities with the ability to drive multiple concurrent initiatives, set priorities strategically, manage technical debt, and integrate emerging technologies into complex product roadmaps. Cross-functional collaboration, and stakeholder management skills. Ability to influence technical direction, negotiate priorities with engineering and product teams, and represent software engineering at the executive level.

Experience

  • 12+ years of senior-level experience in software engineering within the semiconductor, systems, or hardware technology industry
  • Proven track record leading geographically distributed, multi-disciplinary software teams with direct responsibility for defining software architecture, managing the complete development lifecycle, and delivering production-ready software solutions
  • Deep technical expertise across the software stack including firmware/embedded systems, device drivers, OS-level programming (Linux, RTOS), hardware abstraction layers, system software, SDK development, API design, application software, and software tools/utilities
  • Experience with high-speed interface technologies (PCIe, CXL, NVMe, Ethernet, or similar protocols) and system-level integration in data center or enterprise computing environments
  • Background in SoC/ASIC development, memory systems, compute accelerators, or data center infrastructure is highly preferred

If this is the role you have been looking for and want to be part of a growing company with an exciting future, we would really love to hear from you. Together We Kandou It!


Visit us at www.kandou.ai and https://www.linkedin.com/company/kandou-ai/

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The Company
HQ: Lausanne
222 Employees
Year Founded: 2011

What We Do

Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry. Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective.

Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF. These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems.

Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.

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