- Be a Pioneer: Get in on the ground floor of a hypergrowth startup! You'll be part of the leadership team shaping the future of computing.
- Scale the Vision: You will have the opportunity to build, scale, and mentor a team.
- Rewarding Compensation: We offer a competitive salary, performance-based bonuses, and significant equity.
- Flexibility: Benefit from a hybrid work model and flexible time off.
- Strategic Silicon Roadmap: Own the hardware execution strategy. Make critical decisions on process node selection, third-party IP integration, and package design.
- Team Scaling & Mentorship: Recruit and lead a world class team.
- Hardware-Software Relationship: Partner with the Director of Software to ensure the hardware architecture is optimized for modern HPC workloads and compiler efficiency.
- Execution Excellence: Drive the methodology for multi-site design synchronization, ensuring top-tier verification coverage and first-pass silicon success.
- Vendor & Foundry Management: Manage high-level relationships with foundries, EDA vendors, and IP providers to ensure favorable terms and support.
- Post-Silicon Leadership: Oversee the transition from GDSII to silicon bring-up, working with yield and test engineering to drive high-volume manufacturing readiness.
- Experience: 15+ years in semiconductor engineering, with 8+ years in leadership roles managing complex SoC or CPU projects.
- Advanced Node Expertise: Proven track record leading development cycles for bleeding-edge silicon, specifically at 5nm or below technology nodes.
- Education: A Bachelor’s or Master’s in Electrical Engineering or Computer Engineering. A PhD is a plus.
- Technical Mastery: Deep expertise in the full Netlist-to-GDSII flow, including high-speed interconnects, memory hierarchies, and power delivery.
- Tape-out Track Record: Proven history of leading multiple successful tape-outs on advanced FinFET nodes.
- Business Acumen: Ability to balance technical perfection with time-to-market pressures and budgetary constraints.
- Influence: A strong reputation in the silicon industry with the ability to attract top-tier talent and negotiate with global partners.
- Experience with large-scale mesh interconnects or many-core architectures.
- Background in advanced packaging (2.5D/3D IC, Chiplets).
- Direct experience with RISC-V ISA implementation at scale.
What We Do
InspireSemi provides revolutionary high-performance, energy-efficient accelerated computing solutions for High-Performance Computing (HPC), AI, graph analytics, and other compute-intensive workloads. The Thunderbird “supercomputer-cluster-on-a-chip” is a disruptive, next-generation datacenter accelerator designed to address multiple underserved and diversified industries, including financial services, computer-aided engineering, energy, climate modeling, cybersecurity, and life sciences & drug discovery. Based on the open standard RISC-V instruction set architecture, InspireSemi’s solutions set new standards of performance, energy efficiency, and ease of programming. The Company is headquartered in Austin, TX and led by an accomplished team with a proven track record. It is leveraging an efficient, scalable fabless operating model with outsourced manufacturing partners (e.g.- TSMC, ASE). Leading industrial companies, national labs, and computer OEMs value our technology, innovative North America design team, and world-class supply chain partners.
