Customer Platform, SDK & Interoperability Architect - Randa 1.6T AEC Platform

Posted 9 Days Ago
Be an Early Applicant
Hyderabad, Telangana, IND
Hybrid
Expert/Leader
Artificial Intelligence • Hardware • Semiconductor
The Role
Architects Kandou’s customer-facing Randa platform, including SDKs, APIs, diagnostics, telemetry, integrations, and developer documentation. Leads interoperability qualification across networking, switching, and BMC platforms; owns compatibility, release governance, regression strategy, and customer-specific adaptation layers. Partners with firmware, validation, product, and field engineering teams to deliver secure, backward-compatible releases and represents software capabilities in customer technical discussions and escalations.
Summary Generated by Built In

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

We are looking for a Customer Platform, SDK & Interoperability Architect.

Location: Hyderabad, India

Responsabilities

· Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces and reference integrations.

· Define stable APIs, extension points and versioning contracts that support customer-specific requirements without forking the core platform.

· Own C and Python management libraries, command-line tools, log-analysis utilities, integration examples and developer documentation.

· Lead interoperability and qualification across NIC, switch-ASIC and host-BMC platforms; maintain the test matrix, known-failure catalog and regression strategy.

· Represent Kandou software in customer technical discussions and escalations, converting field requirements into governed, reusable platform capabilities.

· Partner with firmware, platform validation, product management and field engineering to deliver secure, backward-compatible and supportable customer releases.

Essential Experience

· 10+ years of platform, embedded or systems software experience, including architecture or technical leadership on shipping products.

· Device-adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers, storage or comparable high-speed hardware.

· Strong API and SDK architecture skills with hands-on C and/or C++ plus Python development.

· Experience designing adaptation, plugin or hook-based architectures that isolate customer-specific logic behind stable interfaces.

· Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers or management software.

· Experience with semantic versioning, backward compatibility, release governance and technical documentation for external developers.

· Working knowledge of hardware management and sideband interfaces such as I2C/SMBus, MCTP or similar protocols.

Excellent customer communication, technical decision-making and cross-functional leadership skills; BS in Electrical Engineering, Computer Engineering or Computer Science, or equivalent experience.

Useful Experience

· CMIS, OSFP MSA, SFF conventions or pluggable-module management software.

· Hyperscaler or tier-one OEM qualification and field-issue triage.

· REST, gRPC, Go or Rust bindings, and schema-driven API development.

· Telemetry pipelines, diagnostic analytics and privacy-aware customer data handling.

· Hardware-in-loop lab automation, host emulation and automated interoperability testing.

· Secure software supply chain, artifact signing, access isolation and standards-group participation.

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would love to hear from you. Together We Kandou It!!

 

Skills Required

  • 10+ years of platform, embedded, or systems software experience, including architecture or technical leadership on shipping products
  • Device-adjacent software experience with networking silicon, AEC/AOC, optical modules, retimers, storage, or comparable high-speed hardware
  • Strong API and SDK architecture skills with hands-on C and/or C++ plus Python development
  • Experience designing adaptation, plugin, or hook-based architectures behind stable interfaces
  • Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers, or management software
  • Experience with semantic versioning, backward compatibility, release governance, and technical documentation for external developers
  • Working knowledge of hardware management and sideband interfaces such as I2C, SMBus, MCTP, or similar protocols
  • Excellent customer communication, technical decision-making, and cross-functional leadership skills
  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or Computer Science, or equivalent experience
  • Experience with CMIS, OSFP MSA, SFF conventions, or pluggable-module management software
  • Hyperscaler or tier-one OEM qualification and field-issue triage experience
  • Experience with REST, gRPC, Go or Rust bindings, and schema-driven API development
  • Experience with telemetry pipelines, diagnostic analytics, and privacy-aware customer data handling
  • Hardware-in-loop lab automation, host emulation, and automated interoperability testing experience
  • Secure software supply chain, artifact signing, access isolation, or standards-group participation experience
Am I A Good Fit?
beta
Get Personalized Job Insights.
Our AI-powered fit analysis compares your resume with a job listing so you know if your skills & experience align.

The Company
222 Employees

What We Do

Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.

Similar Jobs

Samsara Logo Samsara

Account Executive

Artificial Intelligence • Cloud • Computer Vision • Hardware • Internet of Things • Software
Easy Apply
Remote or Hybrid
2 Locations
4000 Employees
152K-190K Annually

Micron Technology Logo Micron Technology

Information Technology Project Manager

Artificial Intelligence • Hardware • Information Technology • Machine Learning
In-Office
Hyderabad, Telangana, IND
45000 Employees
Easy Apply
In-Office
Hyderabad, Telangana, IND
900 Employees

Optum Logo Optum

Assistant Manager

Artificial Intelligence • Big Data • Healthtech • Information Technology • Machine Learning • Software • Analytics
In-Office
Hyderabad, Telangana, IND
160000 Employees

Similar Companies Hiring

Unusual Machines, Inc. Thumbnail
Hardware • Robotics
Orlando, FL
300 Employees
Blee Thumbnail
Artificial Intelligence • Marketing Tech • Software
New York, New York
30 Employees
Vega Thumbnail
Artificial Intelligence • Automotive • Insurance • Transportation
US
65 Employees

Sign up now Access later

Create Free Account

Please log in or sign up to report this job.

Create Free Account