Characterization Engineer

Posted 17 Days Ago
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Saint-Sulpice, Vaud, CHE
In-Office
Senior level
Artificial Intelligence • Semiconductor
The Role
Lead the end-to-end characterization of high-speed SerDes, perform measurements, collaborate with teams, document results, and write automation scripts.
Summary Generated by Built In

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

We are actively seeking a Characterization Engineer for our lab in Switzerland (Lausanne)


Responsibility

  • Lead end-to-end characterization of high-speed SerDes operating at symbol rates above 20 Gbaud
  • Perform jitter, eye-diagram, BER, and margin measurements across PVT
  • Characterize full transmitter and receiver electrical parameters
  • Perform S-parameter, TDR and insertion loss measurements
  • Collaborate with IP architects, digital and analog design teams
  • Documentation of test results and procedures
  • Write and architect test scripts for automation in Python


Required Experience

  • Proven experience characterizing high-speed SerDes designs (>20Baud) over PVT
  • Proven knowledge in both TX and RX characteristics for high-speed designs
  • Proven experience using high-speed oscilloscopes, VNAs, and Spectrum Analyzers above 30GHz
  • Experience defining test plans and test procedures
  • Experience with Python, or other object-oriented programming for test automation, data analysis and report generation
  • Experience with PAM modulation or multi-tonal modulation schemes is a plus
  • Minimum 5 years of relevant work experience


Required Competencies

  • Self-motivated, with a strong sense of ownership and responsibility
  • Good communicator and team player, with experience working in cross-functional teams
  • Strong interest and experience in characterizing high-speed analog circuits
  • Solid understanding of: SI concepts, modulation schemes, TX and RX fundamentals
  • Experience with Python or other object-oriented languages
  • Experience using high-speed oscilloscopes, VNAs, and Spectrum Analyzers
  • Ability to multitask in a high energy environment
  • Schematic entry or PCB design is a plus


Required Education

  • Bachelor´s or Master´s degree in EE, CE, or equivalent work experience

Profiles submitted by third-party recruitment agencies will not be taken into consideration.

Skills Required

  • Proven experience characterizing high-speed SerDes designs (>20Baud) over PVT
  • Proven knowledge in both TX and RX characteristics for high-speed designs
  • Proven experience using high-speed oscilloscopes, VNAs, and Spectrum Analyzers above 30GHz
  • Experience defining test plans and test procedures
  • Experience with Python or other object-oriented programming for test automation, data analysis and report generation
  • Experience with PAM modulation or multi-tonal modulation schemes
  • Bachelor´s or Master´s degree in EE, CE or equivalent work experience
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The Company
HQ: Lausanne
222 Employees
Year Founded: 2011

What We Do

Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry. Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective. Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF. These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems. Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.

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