Career Accelerator Program - Digital Failure Analysis Engineer - MS/PhD

Change the world. Love your job.
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.

The Digital Failure Analysis Engineer is responsible for analyzing early electrical failures in semiconductor devices to identify root cause and support process and platform development. The role focuses primarily on wafer-level yield learning while also investigating qualification issues, quality excursions, and customer returns when necessary to close critical learning loops.
Key Responsibilities

• Failure Data Analysis and Diagnosis: Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.
• Electrical Failure Analysis: Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.
• Cross-Functional Debug and Physical Correlation: Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.

Minimum Requirements:

• Master's degree in Electrical Engineering, Computer Engineering, Electrical & Computer Engineer, Computer Science or related technical field
• Cumulative 3.0/4.0 GPA or higher

Preferred Qualifications:

• Familiarity with digital circuit operation and scan-based test methodologies
• Experience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentation
• Experience with digital IC design, mixed-signal IC design, or related design environments
• Familiarity with memory mapping tools, ATPG diagnostics like Cadence Modus and Synopsys Tetramax and Avalon layouts
• Ability to work collaboratively across engineering teams including design, test, failure analysis, and manufacturing/process development groups
• Strong analytical and problem-solving skills with attention to technical detail